Transparent Four-Rank Memory Module Emulator

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Solution Overview

Problem

Standard memory modules can only accommodate two ranks, limiting the density of memory devices that can be fitted into a memory socket, as four ranks require additional space that standard modules do not provide, and existing solutions to stack devices are not viable due to the lack of chip select signals.

Innovation Solution

A transparent four rank memory module is designed with a front and back side, where each side has two ranks stacked, and an emulator (CPLD) controls which rank is active based on signals from the memory controller, allowing the module to function with only two chip select signals routed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If standard memory modules are used with two chip select signals, then the module fits into standard sockets, but the memory density is limited to two ranks

Engineering Contradiction:
Improvememory densityVSAvoidsignal routing complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent introduces an emulator circuit as an intermediary component that receives the two chip select signals from the memory controller and generates four internal chip select signals. This mediator translates the limited external signals into the required internal signals, enabling four rank operation without requiring additional external signal routing.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The memory module is segmented into four distinct ranks, with each rank having its own chip select signal and memory devices. The emulator divides the control function into multiple segments, allowing each rank to be independently controlled through the generated internal chip select signals.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If four ranks are implemented in a memory module, then memory density increases, but the module requires additional physical space beyond standard dimensions

Engineering Contradiction:
Improvememory densityVSAvoidmodule area
Core Design Contradiction:
Quantity of substanceVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional layout to a three-dimensional stacked configuration. Memory devices are arranged in multiple layers stacked vertically, allowing four ranks to be accommodated within the same footprint area. This vertical stacking enables increased memory density without expanding the module's planar dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Quantity of substance

If four ranks are implemented with stacked memory devices, then memory density increases, but the module lacks sufficient chip select signals to control all ranks

Engineering Contradiction:
Improvememory densityVSAvoidsignal control
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

The emulator serves as a signal mediator that receives two external chip select signals and generates four internal chip select signals through logical operations. This signal translation mechanism provides adequate control signals for all four ranks without requiring additional external signal pins.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The emulator changes the parameter of chip select signals by generating additional signals through logical combinations of the input signals. By modifying the signal parameters (quantity and timing), the system achieves proper control of four ranks while maintaining compatibility with standard two-signal interfaces.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10755757B2Multi-rank memory module that emulates a memory module having a different number of ranks
Publication Date: 2020.08.25 SMART MODULAR TECHNOLOGIES INC
  • US10755757B2 patent drawing
  • US10755757B2 patent drawing
  • US10755757B2 patent drawing

AI summary

A transparent four rank memory module has a front side and a back side. The front side has a third memory rank stacked on a first memory rank. The back side has a fourth memory rank stacked on a second memory rank. An emulator coupled to the memory module activates and controls one individual memory rank from either the first memory rank, the second memory rank, the third memory rank, or the fourth memory rank based on the signals received from a memory controller.