Four-Side Semiconductor Inspection with Rotating Carrier Handling
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Solution Overview
Problem
Existing semiconductor inspection and metrology systems face limitations in illuminating and imaging all four sides of a semiconductor device due to restricted illumination angles, manual changeover requirements, and low throughput, particularly with mirror block systems.
Innovation Solution
A characterization system with a sample carrier, pick-and-place head, and dual-channel imaging subsystem, controlled by a processor, allows simultaneous inspection of two sides of a semiconductor device, followed by 90-degree rotation and repositioning for comprehensive four-sided imaging without manual intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mirror block imaging system is used to image four sides of semiconductor device, then imaging capability is achieved, but throughput is limited due to manual changeover and single imaging device operation
Solution Approach 1:
The system divides the imaging task into multiple independent imaging devices (first imaging device, second imaging device, third imaging device, fourth imaging device), each capable of imaging one or more sides of the semiconductor device. This segmentation allows parallel operation of multiple imaging devices, eliminating the bottleneck of single-device sequential operation and enabling automated high-throughput inspection of all four sides.
Solution Approach 2:
A carrier rotator is introduced as an intermediary component between the sample carrier and the multiple imaging devices. The carrier rotator automatically rotates the carrier to present different sides of the semiconductor device to the appropriate imaging devices, eliminating the need for manual changeover while maintaining proper orientation for comprehensive four-sided imaging.
2Adaptability or versatility
If mirror block system is used, then four-sided imaging is achieved, but illumination angles are limited and hardware is linked to object dimensions
Solution Approach 1:
Each imaging device is configured with independent illumination systems that can provide varied illumination angles without being constrained by mirror block geometry. The system can adapt to different object dimensions and imaging requirements by adjusting illumination parameters independently for each imaging device, providing universal applicability across different semiconductor device sizes and types.
Solution Approach 2:
The system employs dynamic illumination control where each imaging device can independently adjust its illumination angles and parameters. This dynamic capability allows the system to optimize illumination for each specific imaging task and adapt to different object dimensions, eliminating the static constraints of traditional mirror block hardware configurations.
3Speed
If single imaging device operates in mirror block, then imaging is performed, but motion cycles are increased due to up/down movement requirements
Solution Approach 1:
The system transitions from vertical up/down motion in a single imaging device to horizontal rotation in multiple imaging devices arranged around the carrier. By changing the motion dimension from vertical translation to horizontal rotation, the system eliminates the need for repeated up/down motion cycles and enables continuous imaging at higher speed with reduced time loss.
Data Source
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AI summary
A method of inspection or metrology of four sides of a sample is disclosed. The method includes providing samples in a carrier at a first side of an imaging tool and moving the samples from the carrier to the imaging tool via a pick-and-place stage assembly. The method includes imaging first and second sides of the samples via first and second channels of the imaging tool and returning the samples to the carrier. The method includes rotating the carrier by 90 degrees and translating the carrier to an opposite side of the imaging tool and moving the samples individually from the carrier to the imaging tool. The method includes imaging a third and fourth side of the sample via the first and second channel of the imaging tool and returning the one or more samples from the imaging tool to the carrier.