Flexible Printed Circuit Connects Main Board to I/O Board
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Solution Overview
Problem
Conventional personal computers require redesigning the motherboard to accommodate varying customer needs for input/output (I/O) components, leading to increased costs and longer time to market, as well as waste of redundant components due to inflexible layout and design.
Innovation Solution
The electronic apparatus uses a flexible printed circuit (FPC) to connect a main board with individual I/O boards, allowing only the I/O boards to be customized based on customer requirements while keeping the main board unchanged, thereby reducing costs and simplifying the design process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the motherboard design is changed to accommodate different I/O component requirements, then the adaptability to customer needs is improved, but the manufacturing cost and time to market are increased
Solution Approach 1:
The invention divides the traditional single motherboard into two separate functional modules: a main board containing system components (CPU, chipset, memory) and an I/O board containing various input/output components. These modules are connected via a flexible printed circuit board (FPC). This segmentation allows the I/O board to be customized for different customer requirements while the main board remains standardized, thereby improving adaptability without increasing manufacturing complexity or cost.
2Adaptability or versatility
If the motherboard design is changed to accommodate different I/O component requirements, then the adaptability to customer needs is improved, but the time to market is increased
Solution Approach 1:
By segmenting the motherboard into a standardized main board and customizable I/O boards, the invention enables parallel development and manufacturing. The main board can be produced in bulk with standardized components, while I/O boards are manufactured according to specific customer orders. This significantly reduces the time to market compared to redesigning entire motherboards for each configuration.
Solution Approach 2:
The invention prepares the main board with standardized interfaces and the FPC connection structure in advance, allowing I/O boards to be easily attached or swapped later. This preliminary preparation of the main board design enables rapid response to different customer requirements without time-consuming redesigns.
3Ease of manufacture
If a single motherboard design is used for all customers, then the manufacturing cost is reduced, but the I/O components become redundant and unused
Solution Approach 1:
The separation of system components and I/O components into different boards allows each component to be precisely matched to customer needs. Only the required I/O components are manufactured and attached to the main board, eliminating the need to include unused I/O components in every motherboard design. This reduces both manufacturing costs and component waste.
Solution Approach 2:
The invention applies different design qualities to different parts of the system: the main board uses a standardized design optimized for mass production, while the I/O board is customized locally according to specific customer requirements. This local customization eliminates redundant components in each specific application while maintaining cost efficiency through standardized main board production.
4Ease of manufacture
If a single motherboard design is used for all customers, then the manufacturing process is simplified, but the layout flexibility is reduced
Solution Approach 1:
The use of a flexible printed circuit board (FPC) to connect the main board and I/O board provides dynamic layout flexibility. The FPC can be bent, folded, or routed in various configurations to accommodate different spatial requirements and device form factors. This maintains manufacturing simplicity while enabling diverse layout arrangements that a rigid single motherboard design cannot achieve.
Solution Approach 2:
The FPC acts as a flexible interconnection medium that replaces the rigid structure of a single motherboard. This flexible film allows the I/O board to be positioned at various locations and orientations relative to the main board, providing layout flexibility for different device appearances while keeping the manufacturing process simple through standardized connection interfaces.
Data Source
Figure 1~2
Figure 3A
Figure 3B
AI summary
An electronic apparatus (100) including a main board (110), an input/output (I/O) board (120), and a flexible printed circuit (FPC) (200) is provided. The main board includes a first carrier (112), a central processing unit (CPU), a north bridge unit, a south bridge unit, a basic input/output system (BIOS), a memory module, a clock generator, a graphic unit, and at least one power management. The CPU, the north bridge unit, the south bridge unit, the BIOS, the memory module, the clock generator, the graphic unit, and the power management are disposed on the first carrier. The I/O board includes a second carrier (122) and a video connector. The video connector is disposed on the second carrier. The FPC connects the first carrier and the second carrier.