Flexible Printed Circuit Positioning via Through Holes in Mold Frame
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Solution Overview
Problem
Conventional liquid crystal display devices face challenges in efficiently positioning flexible printed circuits with mounted light emitting diodes, leading to inefficiencies and risks of damaging the glass substrate due to stress from protruding boss pins, which hinders the reduction of device thickness.
Innovation Solution
The solution involves creating through holes in both the flexible printed circuit and the mold frame, allowing a pin on an assembly jig to precisely position the circuit during assembly, and using a double-sided adhesive tape with corresponding through holes or notches to secure the components without protrusions, thereby eliminating the need for boss pins and reducing stress on the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If boss pins are used to position the flexible printed circuit, then positioning precision is improved, but device thickness increases and stress damages the glass substrate
Solution Approach 1:
The patent removes the boss pins from the mold frame structure and transfers the positioning function to through-holes formed directly in the mold frame. This extraction eliminates the protruding boss pins that increased device thickness while maintaining positioning precision through the through-hole alignment system.
Solution Approach 2:
The patent introduces an assembly jig as an intermediary tool that uses pins to temporarily position the flexible printed circuit during assembly. The assembly jig mediates between the mold frame and FPC, enabling precise positioning without requiring permanent protruding structures in the final product.
2Manufacturing precision
If boss pins are used to position the flexible printed circuit, then positioning precision is improved, but stress damages the glass substrate
Solution Approach 1:
The patent removes the boss pins that caused stress concentration on the glass substrate. By replacing them with through-holes and an adhesive tape-based fixation system, the harmful stress factor is eliminated while positioning precision is maintained through the through-hole alignment mechanism.
Solution Approach 2:
The assembly jig acts as an intermediary that provides positioning during assembly without transferring stress to the glass substrate. The jig's pins engage with through-holes in the FPC and mold frame, distributing forces away from the fragile glass substrate during the assembly process.
3Volume of moving object
If the flexible printed circuit is folded to cover the rear surface, then space utilization is improved, but positioning complexity increases
Solution Approach 1:
The through-holes in the mold frame serve multiple functions: they guide the assembly jig pins during positioning, provide alignment references for the FPC, and act as fixation points for the adhesive tape. This multi-functionality simplifies the overall positioning system despite the FPC's folded configuration.
Data Source
AI summary
The liquid crystal display device according to the present invention is a thin liquid crystal display device where it is easy to position the flexible printed circuit on which light emitting diodes are mounted. In the liquid crystal display device having a liquid crystal display panel and a flexible printed circuit (FPC) that is connected to the liquid crystal display panel and supplies power for driving display pixels, light emitting diodes (LED) are mounted on a portion of the flexible printed circuit, a mold frame MFR is provided to contain the light emitting diodes, and through holes (60, 61) for positioning are created in both the flexible printed circuit and the mold frame.