FPC Sealing Structure Using Flexible Thin Plates and Adhesive
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Solution Overview
Problem
Existing electronic equipment sealing structures, such as those using grommets or liquid rubber, face challenges in maintaining sealability while minimizing case stiffness and manufacturing complexity, leading to increased costs.
Innovation Solution
An electronic equipment sealing structure that utilizes a case with flexible thin plate portions and an adhesive layer to sandwich a flexible printed circuit board, ensuring a tight seal without the need for complex manufacturing steps or additional case thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a grommet is provided integrally with the FPC to seal the clearance, then sealability is improved, but the stiffness and thickness of the case need to be increased
Solution Approach 1:
The patent replaces the mechanical grommet system with an adhesive bonding system. Instead of using an elastic grommet that requires mechanical fitting and increased case thickness, the invention uses an adhesive layer to seal the clearance between the FPC and case, eliminating the need for increased case stiffness while maintaining sealability.
Solution Approach 2:
The patent employs thin plate portions with flexibility that can conform to the FPC and case interface. These flexible thin plates provide the necessary sealing capability without requiring thick case walls, allowing the case to remain thin while still achieving effective sealing.
2Reliability
If liquid rubber is used to fill the clearance, then sealability is improved, but manufacturing complexity and cost increase due to additional grooves and steps
Solution Approach 1:
The patent extracts the sealing function from the case structure itself. Instead of integrating grooves or special features into the case for liquid rubber filling, the invention uses separate adhesive layers and thin plate portions that can be applied independently, simplifying case manufacturing while maintaining sealing effectiveness.
Solution Approach 2:
The adhesive layers are provided in advance on the thin plate portions before assembly. This preliminary preparation eliminates the need for complex in-process sealing operations, allowing for simpler manufacturing steps compared to liquid rubber filling that requires precise groove formation and filling operations.
3Reliability
If a grommet is used for sealing, then sealability is improved, but material cost and manufacturing cost increase
Solution Approach 1:
The patent uses inexpensive adhesive materials and thin plate portions instead of costly elastic grommets. The adhesive layers provide effective sealing at a lower material cost, and the simplified manufacturing process reduces production costs, making the overall solution more economical while maintaining sealability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves improved sealability against water and dust ingress with a simple design, reducing void spaces and maintaining structural integrity while minimizing material and manufacturing costs.
Implementation Method 1
an adhesive layer is provided so as to close a clearance between an inner wall surface of the opening and the flexible printed circuit board
Data Source
AI summary
Provided is an electronic equipment sealing structure that includes a case, a flexible printed circuit board, and an adhesive layer, in which the case includes a case body, an opening provided in the case body, and a pair of thin plate portions having flexibility; part of the flexible printed circuit board is inserted into the case body through the opening; one thin plate portion and the other thin plate portion of the pair of thin plate portions are provided along the opening so as to face each of first and second surfaces of the flexible printed circuit board; and the adhesive layer is provided so as to close a clearance between an inner wall surface of the opening and the flexible printed circuit board.