FPC Shield Enclosure for RF Modules
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Solution Overview
Problem
Conventional radio frequency modules require extra shield cases for electromagnetic shielding, leading to increased manufacturing costs, potential soldering mistakes, and limitations in reducing module thickness.
Innovation Solution
A radio frequency module with electronic components mounted on a flexible printed circuit board, where the shield enclosure is formed by folding the board to house components, eliminating the need for an extra shield case and allowing for reduced manufacturing costs and thinner designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an extra shield case is used for electromagnetic shielding, then shielding effectiveness is improved, but manufacturing cost increases and device complexity increases
Solution Approach 1:
The patent merges the circuit board and shield case into a single integrated structure. The ground pattern on the circuit board serves dual purposes: as an electrical conductor for circuit functionality and as an electromagnetic shield. This eliminates the need for a separate shield case, reducing manufacturing cost and structural complexity while maintaining shielding effectiveness.
Solution Approach 2:
The ground pattern on the circuit board performs multiple functions simultaneously: it provides electrical grounding for circuit operation and acts as an electromagnetic shield. This multi-functionality eliminates the need for dedicated shielding components, resolving the contradiction between shielding effectiveness and device complexity.
2Object-affected harmful factors
If an extra shield case is used for electromagnetic shielding, then shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the shielding function with the existing circuit board structure. By using the ground pattern already present on the circuit board for both electrical grounding and electromagnetic shielding, the invention eliminates the need to manufacture and assemble a separate shield case, thereby reducing manufacturing cost while maintaining shielding effectiveness.
Solution Approach 2:
The ground pattern serves dual purposes: electrical grounding and electromagnetic shielding. This multi-functionality eliminates the need for additional shielding components and their associated manufacturing and assembly costs, resolving the contradiction between shielding effectiveness and manufacturing cost.
3Object-affected harmful factors
If a shield case is used for electromagnetic shielding, then shielding effectiveness is improved, but module thickness increases
Solution Approach 1:
The patent merges the shielding function into the circuit board itself. The ground pattern on the circuit board provides electromagnetic shielding without requiring an additional shield case layer, thereby maintaining shielding effectiveness while reducing overall module thickness.
Solution Approach 2:
The invention utilizes the two-dimensional ground pattern on the circuit board surface to provide three-dimensional electromagnetic shielding. By arranging conductive traces in specific patterns on the board surface, the invention achieves shielding effectiveness without adding thickness in the third dimension.
4Object-affected harmful factors
If partial soldering is performed to fix the shield case, then shielding effectiveness is improved, but reliability decreases due to potential soldering mistakes
Solution Approach 1:
The patent combines the shielding function with the circuit board's ground pattern, eliminating the need for separate shield case attachment through soldering. This integration removes the soldering step entirely, preventing soldering mistakes and improving manufacturing reliability while maintaining shielding effectiveness through the integrated ground pattern design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs, enhances reliability, and enables the creation of smaller, thinner modules without the need for soldering or reflow processes, while maintaining effective electromagnetic shielding.
Implementation Method 1
a shield enclosure that shields at least part of the electronic components from the outside The shield enclosure is formed by folding the flexible printed circuit board in such a way that the electronic components mounted thereon are housed inside the shield structure
Data Source
AI summary
An enclosure is formed by folding an FPC board having, on the top face thereof, electronic components and, on the back face thereof, a ground conductor pattern in such a way that the electronic components mounted thereon are housed inside the enclosure. The electronic components housed inside the enclosure are covered with the ground conductor pattern. This means that the enclosure serves as a shield enclosure that electromagnetically shields at least part of the electronic components from the outside. In this way, the shield enclosure is formed by folding the FPC board. This makes it possible to realize an electromagnetic shield structure without using an extra shield case as used in the conventional modules.