FPC Board Terminal Thickness Design for OLED Short Circuit Prevention
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Solution Overview
Problem
The existing methods for connecting flexible printed circuit (FPC) boards to organic light-emitting diode (OLED) panels often result in short circuits due to carbonization of the polyimide material at the edges during laser cutting, leading to equipment damage and increased costs for cleaning.
Innovation Solution
A FPC board design with a circuit board terminal thickness greater than the sum of the first wire layer and protective layer thickness, featuring a conductive bump and conductive film, and a manufacturing method that includes forming and patterning conductive materials, electroplating, and covering with protective layers to prevent short circuits when connected to OLED panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the FPC board is connected to the OLED panel using conventional methods, then the connection is established, but the polyimide material at the edge carbonizes and causes short circuits
Solution Approach 1:
The patent extracts the harmful carbonized polyimide material from the connection interface by designing the circuit board terminal to extend beyond the protective layer, ensuring that only the conductive terminal makes contact with the OLED panel terminal, not the polyimide substrate edge
Solution Approach 2:
The patent introduces an intermediary structure where the circuit board terminal acts as a mediator between the FPC board and OLED panel, with the terminal's conductive material providing a clean electrical connection interface that prevents direct contact between the polyimide edge and the OLED panel
2Ease of operation
If the edge of the base substrate contacts the circuit board terminal, then connection is achieved, but short circuit occurs due to carbonized material
Solution Approach 1:
The patent applies local quality by creating a differentiated structure where the circuit board terminal has different properties from the protective layer - the terminal extends locally beyond the protective layer to provide a dedicated contact point, ensuring that only the terminal material (not the polyimide) contacts the OLED panel terminal
3Ease of manufacture
If carbonized PI material is present at the connection interface, then connection may be established, but cleaning requires new methods and increases equipment cost
Solution Approach 1:
The patent performs preliminary action by designing the circuit board terminal structure in advance to prevent carbonization contact before it occurs - the terminal's extended geometry ensures that the polyimide edge never contacts the OLED panel terminal, eliminating the need for post-manufacturing cleaning operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short circuits by ensuring the edge of the base substrate contacts the protective layer instead of the circuit board terminal, enhancing product quality and reducing equipment costs associated with cleaning.
Implementation Method 1
a manufacturing method that includes forming and patterning conductive materials, electroplating, and covering with protective layers
Data Source
AI summary
A FPC board and a method for manufacturing the same and an OLED display device are provided. The FPC board includes a substrate, a first wire layer disposed on one side of the substrate, a circuit board terminal disposed at an edge on one side of the substrate and connected to the first wire layer, and a first protective layer covering the first wire layer. The thickness of the circuit board terminal is larger than the sum of the thicknesses of the first wire layer and the first protective layer. When the FPC board is connected to the OLED panel, one side of the base substrate on which the panel terminal is provided is opposite to one side of the substrate on which the circuit board terminal is provided, such that the base substrate overlaps with the substrate to connect the circuit board terminal and the panel terminal.