FPCB Anti-Vibration Layer for Mobile Display Noise Reduction
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Solution Overview
Problem
Conventional display modules for mobile communication devices generate noise due to vibrations caused by the swelling or shrinking of capacitors on flexible printed circuit boards (FPCBs) under varying driving voltages, which existing methods struggle to adequately mitigate, especially as noise measurement standards become more stringent.
Innovation Solution
Incorporating an anti-vibration layer on the second surface of the FPCB, corresponding to the location of electronic components, to alleviate deformation forces and reduce resonance, thereby minimizing noise generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the characteristics of the capacitor are altered to reduce deformation, then noise is reduced, but the effect is insufficient under strict noise tolerance standards
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the capacitor and the FPCB. This adhesive layer has controlled extensibility properties that allow it to absorb deformation forces generated by capacitor swelling and shrinking, thereby reducing noise while maintaining reliable electrical connections.
Solution Approach 2:
The extensibility parameter of the adhesive layer is specifically optimized to balance between allowing capacitor deformation and preventing excessive FPCB vibration. By adjusting the adhesive's extensibility, the system achieves effective noise reduction while maintaining connection reliability under strict noise standards.
2Object-affected harmful factors
If capacitors are symmetrically disposed on both surfaces of the FPCB to reduce vibration, then noise is reduced, but manufacturing complexity increases
Solution Approach 1:
The invention extracts the vibration reduction function from the capacitor arrangement and relocates it to the adhesive layer. This allows capacitors to be disposed in conventional single-sided configurations while the adhesive layer independently provides vibration damping, thereby reducing noise without increasing manufacturing complexity.
3Reliability
If the adhesive layer has high extensibility to accommodate capacitor deformation, then connection reliability is maintained, but FPCB vibration increases
Solution Approach 1:
The adhesive layer's extensibility is precisely controlled within an optimal range. This parameter optimization allows the adhesive to accommodate capacitor deformation forces without transmitting excessive vibration to the FPCB, thereby simultaneously maintaining connection reliability and reducing noise.
Solution Approach 2:
The adhesive layer exhibits different mechanical properties at different locations: it provides high extensibility where capacitors are mounted to accommodate deformation, while providing sufficient rigidity in other areas to minimize FPCB vibration and noise transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anti-vibration layer effectively reduces noise levels by 3db to 19db, depending on the display mode, and simplifies the manufacturing process by avoiding the complexity of symmetrically disposing capacitors on both surfaces of the FPCB.
Implementation Method 1
the anti-vibration layer is disposed on the second surface of the flexible printed circuit board, and the location of the anti-vibration layer corresponds to the location of the electronic component so that deformation of the electronic component is alleviated. Accordingly, the resonance due to vibration of the flexible printed circuit board is reduced.
Data Source
AI summary
An embodiment of the invention discloses an display module for mobile communication device which comprises a display panel, a flexible printed circuit board, an electronic component. The flexible printed circuit board is coupled to the display panel and is divided into a first portion and a second portion. The electronic component is disposed on a first surface of the flexible printed circuit board, and the location of the electronic component corresponds to that of the second portion of the flexible printed circuit board. The extensibility of the second portion of the flexible printed circuit board is smaller than that of the first portion of the flexible printed circuit board.