FPCB Connector Layout for High-Speed Differential Signal Integrity

The patent transitions from a planar arrangement of connection parts to a three-dimensional configuration by forming connection parts on both the front surface and back surface of the flexible printed circuit board. This multi-layer arrangement allows signal lines to be routed through different spatial dimensions, maintaining even transmission path lengths and consistent impedance characteristics while accommodating high terminal density in a compact connector footprint.

The connection parts are segmented into multiple independent groups located on different surfaces and layers of the FPCB. Each connection part is independently configured to ensure uniform signal path characteristics. This segmentation allows the connector to achieve high terminal density without compromising signal integrity, as each segmented connection path can be optimized independently for even length and consistent impedance.

To support the high data transmission requirements of 4K/8K imaging without increasing connector size, the patent utilizes three-dimensional space by arranging connection parts on multiple FPCB surfaces and layers. This vertical and multi-surface stacking enables a high density of signal terminals within a compact connector envelope, accommodating the increased pixel count and data volume while maintaining small form factor.

The patent employs a flexible printed circuit board as the substrate for the connector, utilizing the inherent flexibility and thinness of the FPCB material. This allows the connector to achieve high terminal density in a compact, flexible package that can be easily integrated into camera systems with high-resolution imaging elements, supporting increased data transmission capacity without proportional increase in connector size.