FPCB Guide Frame Stress Redirection in Display Apparatus

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Solution Overview

Problem

Flexible printed circuit boards (FPCBs) in display apparatuses are prone to cracking due to excessive bending and shear stress, leading to a shortened lifespan.

Innovation Solution

The design incorporates a mold frame with a guide frame that redirects the maximum bending stress away from the area of maximum shear stress, using a bent guide frame to distribute stress more evenly across the FPCB, thereby reducing both bending and shear stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the FPCB is made flexible to enable bending, then the FPCB can be easily bent and connected, but the FPCB is prone to cracking due to excessive bending and shear stress

Engineering Contradiction:
Improvebending capabilityVSAvoidcracking resistance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

A guide frame is introduced as an intermediary component between the FPCB and the mold frame. The guide frame redirects the bending stress away from the FPCB's vulnerable connection lines, allowing the FPCB to bend while preventing excessive stress concentration that would cause cracking.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The guide frame is designed with specific geometric parameters (convex bending shape, positioning relative to the FPCB's connection lines) that change the stress distribution parameters. By positioning the guide frame's convex portion at a distance greater than half the FPCB's width from the connection lines, the stress is redistributed to safer regions of the FPCB.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If the FPCB is bent toward the mold frame, then the FPCB can be connected to the PCB, but maximum bending stress and shearing stress are generated at different positions

Engineering Contradiction:
Improveconnection capabilityVSAvoidstress distribution
Core Design Contradiction:
Ease of operationVSStress or pressure

Solution Approach 1:

The guide frame acts as a mediator that controls and redirects the stress distribution during bending. It ensures that the maximum bending stress and maximum shearing stress occur at different positions on the FPCB, preventing both types of stress from concentrating at the same vulnerable point (the connection lines).

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The guide frame introduces asymmetric stress distribution by its convex bending shape and specific positioning. This asymmetry deliberately shifts the maximum bending stress away from the connection lines, creating a stress distribution pattern where bending and shearing stresses are separated in location rather than叠加 (superimposed) at the same point.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS9482915B2Display apparatus
Publication Date: 2016.11.01 SAMSUNG DISPLAY CO LTD
  • US9482915B2 patent drawing
  • US9482915B2 patent drawing
  • US9482915B2 patent drawing

AI summary

A display apparatus is disclosed. In one aspect, the display apparatus includes a first display substrate including i) a first plane on which an image is displayed and ii) a second plane opposite to the first plane. The display apparatus also includes a second display substrate formed at least partially overlapping second plane, a guiding portion bent and connected to at least one of the first and second display substrates, a mold frame accommodating and supporting the second display substrate, and a flexible printed circuit board (FPCB) including i) a first area attached to the second plane of the first display substrate and ii) a second area connected to and guided by the guiding portion, wherein the FPCB is bent at least partially around the mold frame.