FPCB Impedance Compensation in Foldable Hinge Modules
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Solution Overview
Problem
In foldable electronic devices, the bending of the flexible printed circuit board (FPCB) across the hinge module can cause separation of layers, leading to impedance mismatch and signal distortion, particularly when the device transitions between folded and unfolded states, resulting in degraded communication quality.
Innovation Solution
The device incorporates a hinge module with sensors to detect folding angles and impedance changes, and a tuner to compensate for impedance fluctuations, ensuring stable signal transmission through processor control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the FPCB is disposed across the first housing and the second housing through the hinge module to enable folding, then the device achieves foldable functionality and compact form factor, but the bending of the FPCB causes layer separation and impedance mismatch
Solution Approach 1:
The patent applies dynamics by making the impedance compensation elements adjustable based on the folding state. The tuner circuit components (capacitors and inductors) are dynamically adjusted according to the detected folding angle to compensate for impedance changes, allowing the system to adapt its electrical characteristics to maintain signal stability across different mechanical states.
Solution Approach 2:
The patent implements feedback by using sensors to detect the folding angle and impedance changes, then using this information to control the tuner circuit. The processor receives sensor data about the folding state and automatically adjusts the impedance compensation elements accordingly, creating a closed-loop system that maintains optimal signal transmission despite mechanical changes.
2Reliability
If the FPCB layers are kept together to maintain impedance, then signal stability is improved, but the flexibility and folding capability are restricted
Solution Approach 1:
The patent applies parameter changes by modifying the electrical parameters (impedance) of the FPCB system through adjustable compensation elements. By changing the values of capacitors and inductors in the tuner circuit based on the folding state, the system compensates for impedance variations caused by mechanical deformation, allowing both folding flexibility and impedance matching to coexist.
Solution Approach 2:
The patent introduces an intermediary impedance compensation circuit between the FPCB and the signal transmission path. This tuner circuit acts as a mediator that corrects impedance mismatches caused by FPCB bending, allowing the FPCB to maintain its flexibility while the intermediary circuit ensures stable signal transmission by compensating for the mechanical deformations.
3Reliability
If sensors and tuners are added to detect and compensate impedance changes, then signal stability is maintained, but device complexity increases
Solution Approach 1:
The patent applies universality by integrating multiple functions into the processor unit. The processor not only controls the tuner circuit for impedance compensation but also receives and processes data from sensors, manages the folding state detection, and coordinates the overall signal transmission system. This multi-functional approach reduces the need for separate dedicated control units, thereby managing complexity while maintaining signal stability.
Data Source
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AI summary
An electronic device according to one embodiment of the present invention comprises: a hinge module; a first housing which comprises a first printed circuit board, and at least a portion of which is coupled to a first side of the hinge module; a second housing which comprises a second printed circuit board, and at least a portion of which is coupled to a second side of the hinge module; an FPCB which is arranged to cross the first housing and the second housing via the hinge module, and is configured to electrically connect the first printed circuit board and the second printed circuit board; a first sensor electrically connected to the first printed circuit board so as to detect the folding angle or the unfolding angle of the first housing and the second housing; a second sensor electrically connected to the first printed circuit board so as to detect an impedance change of the FPCB, on the basis of the folding angle or the unfolding angle of the first housing and the second housing; a first tuner arranged on the first printed circuit board so as to compensate for the impedance of the FPCB generated as the first housing and the second housing fold; and a processor operatively connected to the FPCB, the first sensor, the second sensor, and the first tuner, wherein the processor can be configured to compensate for the impedance change of the FPCB by controlling the first tuner on the basis of the folding angle or the unfolding angle of the first housing and the second housing.