FPCB Patch Antenna Layout for Compact UWB Assembly
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Solution Overview
Problem
Existing electronic devices face challenges in efficiently integrating high-frequency antennas, such as UWB antennas, within their internal spaces due to complexity and assembly constraints, which hinders their ability to perform accurate positioning operations.
Innovation Solution
A multi-layered FPCB structure with a patch antenna configuration, including a first portion overlapping a metal member, a second portion coupled to a connector, and a third portion with a reduced intermediate conductive layer and dielectric material thickness, allowing for flexible assembly and enhanced antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layered FPCB structure with uniform thickness is used for the antenna, then the antenna performance is maintained, but the assembly flexibility and ease of integration in the inner space of the housing is reduced
Solution Approach 1:
The FPCB is designed with variable thickness: the first portion (antenna region) has a first thickness to maintain antenna performance, while the second portion (connection region) has a second thickness smaller than the first thickness. This local differentiation allows the antenna to function properly while enabling easier assembly and integration in the housing's inner space.
2Reliability
If the intermediate conductive layer is provided throughout the entire FPCB, then the electrical connectivity is ensured, but the assembly flexibility and ease of disposal is reduced
Solution Approach 1:
The intermediate conductive layer is extracted from the third portion of the FPCB, being provided only in the second portion and third portion but not in the first portion where the antenna is located. This selective removal simplifies the structure in the antenna region while maintaining necessary electrical connectivity in the connection regions, thereby improving ease of disposal and assembly.
3Strength
If a thick dielectric material is used throughout the FPCB, then the structural integrity is maintained, but the assembly flexibility and integration in limited space is reduced
Solution Approach 1:
The dielectric material thickness is varied locally: the first portion has a greater first thickness to maintain structural integrity and support the antenna, while the second and third portions have a smaller second thickness to reduce overall volume and facilitate assembly in the housing's limited inner space.
Data Source
AI summary
An electronic device is provided, which includes an FPCB, wherein the FPCB includes a first portion in which an antenna is provided in the form of a patch antenna that overlaps a metal member, a second portion coupled to a connector of the circuit board, and a third portion arranged between the first portion and the second portion. A layered structure of the FPCB may include a dielectric material having a first thickness in the first portion overlapping the metal member and having a second thickness smaller than the first thickness in the second portion and the third portion, a first conductive layer provided in the first direction from the dielectric material, and an intermediate conductive layer provided in a second direction opposite to the first direction, from the dielectric material. The intermediate conductive layer may be provided only in the second portion and the third portion and may not be provided in the first portion. A portion of the dielectric material in the first portion can be arranged to face the metal member.