Flexible FPCB Power Module Layout for Insulated Double-Sided Cooling
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Solution Overview
Problem
Conventional power modules with double-sided cooling methods face insulation issues and increased costs due to wire bonding, leading to heat dissipation losses and larger substrate sizes.
Innovation Solution
A power module utilizing a flexible and deformable FPCB for electrical connections between chips and substrates, eliminating wire bonding and signal leads, with through holes for insulation and a connector for external connection, ensuring insulation and reducing overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connection, then electrical connection is achieved, but insulation problems occur and cost increases
Solution Approach 1:
The patent extracts and eliminates wire bonding and signal leads from the power module structure. Instead of using separate wire bonding processes and lead structures, the invention integrates electrical connections directly into the substrate through conductive patterns, removing the problematic components that caused insulation issues
Solution Approach 2:
The patent merges the functions of electrical connection and insulation into a single integrated substrate structure. The substrate simultaneously provides mechanical support, electrical connectivity through embedded conductors, and insulation through its dielectric material, eliminating the need for separate wire bonding and lead structures
2Reliability
If wire bonding is used for electrical connection, then electrical connection is achieved, but substrate size increases
Solution Approach 1:
The patent removes wire bonding patterns and signal leads that occupied significant substrate area. By eliminating these separate connection structures and integrating connectivity directly into the substrate layout, the overall module size is reduced while maintaining all necessary electrical connections
3Temperature
If conventional double-sided cooling method is used, then heat dissipation is improved, but cost increases due to high heat dissipation material
Solution Approach 1:
The patent makes the substrate serve multiple functions simultaneously: it provides mechanical support, electrical connectivity through conductive patterns, insulation through dielectric properties, and heat dissipation through thermally conductive pathways. This multi-functionality eliminates the need for separate high-cost heat dissipation materials while achieving effective thermal management
Data Source
AI summary
A power module is provided. In the power module, electrical connection to the outside is enabled through a FPCB made to be flexible and deformable, and as terminals for signal transmission and wire bonding for connecting terminals are eliminated, insulation is ensured and the overall size is reduced.