FPGA Adapter Board for CPU Socket Integration

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Solution Overview

Problem

Current computer systems face challenges in integrating co-processors and different CPUs without redesigning the motherboard, due to space constraints, heat dissipation issues, and the need for additional power and high-speed interfaces, limiting the deployment of FPGA accelerators to specific systems with expansion slots.

Innovation Solution

An adapter board with an I/O translator, which is part of a field programmable gate array (FPGA), is used to bridge the socket and co-processor, enabling the integration of processors and co-processors into standard computer systems without modifying existing hardware or BIOS, utilizing existing motherboard resources and accommodating heat sinks for cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If co-processors are added to existing computer systems using expansion slots, then additional functionality and performance are provided, but the system accepts design limitations of expansion options and cannot achieve high-speed integration

Engineering Contradiction:
Improvefunctionality enhancementVSAvoiddata transport speed
Core Design Contradiction:
Adaptability or versatilityVSSpeed

Solution Approach 1:

The patent introduces an adapter board as an intermediary device that connects co-processors to the CPU socket through translation circuitry. This adapter serves as a mediator that enables high-speed communication between the co-processor and motherboard resources without requiring expansion slot limitations, thus resolving the speed constraint while maintaining adaptability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system is segmented into distinct functional components: the adapter board, the co-processor, and the motherboard. This segmentation allows the co-processor to be integrated at the socket level rather than through expansion slots, enabling high-speed access to motherboard resources while maintaining system versatility.

Inventive Principle:
Principle #1Segmentation

2Speed

If the motherboard is redesigned to integrate co-processors directly, then high-speed integration and proper power/memory provision are achieved, but the cost and complexity of system redesign increases

Engineering Contradiction:
Improveintegration speedVSAvoidsystem redesign complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The adapter board acts as an intermediary that provides high-speed integration capabilities without requiring motherboard redesign. It includes translation circuitry that interfaces with the CPU socket and provides necessary power, memory, and signal translation, thus achieving fast integration while keeping the motherboard unchanged.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The adapter board is designed as a universal solution that can support multiple co-processor types and configurations. It provides multiple functions including signal translation, power regulation, memory interface, and heat dissipation management, thereby achieving high-speed integration without increasing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If physical space is increased on the motherboard to accommodate co-processors, then proper power and memory provision are enabled, but the compact form factor and space efficiency are compromised

Engineering Contradiction:
Improveco-processor integration capabilityVSAvoidmotherboard area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The adapter board is designed to nest within the existing CPU socket footprint on the motherboard. The co-processor and its support circuitry are integrated on the adapter board itself, which fits into the socket area, thus providing full co-processor integration capability without increasing the motherboard's physical area.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The solution moves the co-processor integration from the motherboard plane to a vertical dimension by using an adapter board that plugs into the socket. This dimensional change allows proper power and memory provision while maintaining the compact horizontal footprint of the motherboard.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Temperature

If heat dissipation capacity is increased to handle co-processor heat, then proper cooling is provided, but the compact design and space constraints are worsened

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidcooling space
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The heat dissipation solution is nested within the adapter board structure. The adapter board incorporates heat sinks and thermal management components that are integrated with the co-processor package, providing adequate cooling capacity within the same vertical space occupied by the adapter itself, thus not increasing the motherboard's horizontal area.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS7454550B2Systems and methods for providing co-processors to computing systems
Publication Date: 2008.11.18 XTREMEDATA INC
  • US7454550B2 patent drawing
  • US7454550B2 patent drawing
  • US7454550B2 patent drawing

AI summary

Computing systems with conventional CPUs coupled to co-processors or accelerators implemented in FPGAs (Field Programmable Gate Arrays). One embodiment of the systems and methods according to the invention includes a FPGA accelerator implemented in a computer system by providing an adapter board configured to be used in a standard CPU socket.