Bridged FPGA-ASIC Circuit for Low-Latency Application Execution

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The complexity in ASIC design leads to potential errors and increased development costs, and since ASICs are not reprogrammable, redesigns are necessary for different applications, which can delay product shipments and increase costs. Additionally, integrating multiple components in ASICs is beneficial for applications with critical latency but not for individual operations, where performance can be improved by offloading functionalities to a bridge chip.

Innovation Solution

A system comprising a Field-Programmable Gate Array (FPGA) and an Application-Specific Integrated Circuit (ASIC) on the same circuit board, where the FPGA decodes instructions and transmits them to the ASIC for execution, allowing the ASIC to be swapped for different applications, and handles communications with external devices, reducing design complexity and costs while improving performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If ASIC integrates multiple components for critical latency applications, then performance is improved, but device complexity and design errors increase

Engineering Contradiction:
ImprovelatencyVSAvoidASIC design complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The system divides functionality into two separate chips: an ASIC chip that handles computation-critical functions where latency matters, and an FPGA chip that handles communication and control functions. This segmentation allows each chip to be optimized for its specific purpose without the complexity of integrating all functions into a single ASIC.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The FPGA chip acts as an intermediary between external devices and the ASIC chip. It handles communication protocols, data formatting, and control operations, allowing the ASIC to focus purely on computation without the overhead of communication complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If ASIC is designed for a specific application, then manufacturing precision is improved, but adaptability deteriorates requiring redesigns for different applications

Engineering Contradiction:
ImproveASIC design precisionVSAvoidapplication adaptability
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The system makes the communication and control portion dynamic and reconfigurable through the FPGA chip, while keeping the computation-critical ASIC portion static and optimized. When application requirements change, only the FPGA needs to be reconfigured or replaced, not the entire ASIC design.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The FPGA chip provides universal functionality for handling various communication protocols and control operations across different applications. This allows the same ASIC chip to serve multiple applications by pairing it with different FPGA configurations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If all functionalities are integrated in ASIC, then device complexity is reduced, but ease of operation deteriorates requiring swapping entire chips for different applications

Engineering Contradiction:
Improvesystem complexityVSAvoidASIC swapping operation
Core Design Contradiction:
Device complexityVSEase of operation

Solution Approach 1:

By segmenting the system into ASIC and FPGA components, the patent enables independent replacement of the FPGA chip while keeping the ASIC chip in place. This reduces the operational burden compared to swapping entire integrated systems.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11283451B1Bridged integrated circuits
Publication Date: 2022.03.22 GOOGLE LLC
  • US11283451B1 patent drawing
  • US11283451B1 patent drawing
  • US11283451B1 patent drawing

AI summary

Methods, systems, and apparatus, including a system that includes a first integrated circuit chip configured to store application logic for one or more executable applications; and a second integrated circuit chip communicatively coupled to the first integrated circuit chip, the second integrated circuit chip including an instruction decoder configured to decode instructions for executing the one or more executable applications; and a communication interface configured to transmit the decoded instructions to the first integrated circuit chip to execute the one or more executable applications on the first integrated circuit chip.