Multi-Chip FPGA Logic Drive to Cut ASIC NRE Costs
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Solution Overview
Problem
The high Non-Recurring Engineering (NRE) costs and inefficiencies in transitioning from Field Programmable Gate Array (FPGA) IC chips to Application Specific IC (ASIC) or Customer-Owned Tooling (COT) chips due to larger chip size, higher power consumption, and increased costs with advanced semiconductor technology nodes, hinder innovation and adoption of advanced semiconductor technologies.
Innovation Solution
A standardized commodity logic drive comprising multiple FPGA IC chips and non-volatile memory IC chips, allowing for field programming and reducing NRE costs by enabling software development without the need for expensive ASIC or COT chip design, thereby facilitating innovation and adoption of advanced semiconductor technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If FPGA IC chips are used for advanced applications, then adaptability and ease of operation are improved, but chip size, power consumption, and fabrication cost increase
Solution Approach 1:
The patent segments the logic drive functionality across multiple FPGA IC chips packaged together in a multi-chip module. Each chip can be independently programmed and optimized, allowing the system to achieve high adaptability while keeping individual chip sizes manageable and cost-effective for advanced technology nodes
Solution Approach 2:
The logic drive is designed as a universal platform that can be field-programmed for different applications (AI, machine learning, IoT, etc.). The multi-chip FPGA architecture provides universal functionality that replaces the need for custom ASIC designs, maintaining adaptability while reducing individual chip complexity and size
2Adaptability or versatility
If FPGA IC chips are used for advanced applications, then adaptability is improved, but power consumption increases
Solution Approach 1:
By dividing the logic drive into multiple specialized FPGA chips, each chip can be optimized for specific workloads and powered down when not in use. This segmentation allows for more efficient power management compared to a single large FPGA or ASIC, reducing overall power consumption while maintaining adaptability
Solution Approach 2:
The patent enables dynamic reconfiguration of the FPGA logic blocks through field programming, allowing the system to optimize power consumption by activating only the necessary logic resources for each specific application. This parameter change capability allows adaptability without proportionally increasing power consumption
3Adaptability or versatility
If FPGA IC chips are used for advanced applications, then adaptability is improved, but fabrication cost increases
Solution Approach 1:
The multi-chip module architecture allows standardization of individual FPGA chip designs that can be manufactured using established processes. By segmenting the system into multiple identical or similar chips rather than requiring custom large-scale integration, fabrication costs are reduced while maintaining adaptability through programmability
Solution Approach 2:
The patent uses multiple copies of standardized FPGA chip designs rather than custom ASIC designs. These standardized chips can be mass-produced using established fabrication processes, significantly reducing per-unit costs compared to custom silicon, while the field-programmable nature maintains adaptability
4Productivity
If ASIC or COT chip design is implemented, then performance is improved, but Non-Recurring Engineering cost increases greatly
Solution Approach 1:
Instead of investing in expensive custom ASIC or COT chip designs, the patent uses multiple copies of commercially available FPGA chips. These standardized components eliminate the need for costly mask sets and custom fabrication processes, reducing NRE costs by over $5M while maintaining the ability to achieve high performance through optimized field programming and multi-chip parallelism
Data Source
AI summary
A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.


