FPGA Logic Tile Memory Layout Using Reconfigurable I/O
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Solution Overview
Problem
Existing integrated circuits, such as FPGAs, face challenges in efficiently integrating memory arrays with logic tiles, leading to suboptimal performance due to limited interconnectivity and inefficient use of I/O pins, which restricts the configuration and reconfiguration capabilities.
Innovation Solution
The integration of memory arrays, including SRAM, DRAM, Flash, EPROM, EEPROM, and MRAM, between and adjacent to logic tiles within the programmable/configurable logic circuitry, utilizing unused I/O pins for internal tile-to-tile communication, enabling more flexible and efficient configuration and operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory arrays are integrated between and adjacent to logic tiles, then tile-to-tile communication efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges memory arrays with logic tiles by positioning memory arrays between and adjacent to logic tiles, creating a unified architecture where memory and logic components are closely integrated. This merging enables direct coupling between logic tiles and memory arrays through shared interconnect structures, improving communication efficiency while managing complexity through systematic integration patterns.
Solution Approach 2:
The interconnect structures are designed to serve multiple functions: they provide both logic-to-logic communication and logic-to-memory access pathways. The same interconnect network handles data transfer between adjacent logic tiles and between logic tiles and memory arrays, reducing the need for separate dedicated pathways and thereby improving efficiency without proportionally increasing complexity.
2Productivity
If unused I/O pins are utilized for internal tile-to-tile communication, then resource utilization is optimized, but ease of operation decreases
Solution Approach 1:
I/O pins are designed with multi-functionality, capable of operating in both I/O mode for external communication and internal communication mode for tile-to-tile data transfer. The same physical pin structure supports both external signal interfaces and internal logic array connections, optimizing resource utilization by eliminating dedicated internal pins while maintaining operational capability through configurable mode switching.
Solution Approach 2:
The I/O pins incorporate dynamic reconfiguration capability, allowing their function to be changed between I/O operations and internal communication operations based on configuration settings. This dynamic switching enables the system to adapt pin functionality to different operational requirements, optimizing resource usage while managing operational complexity through programmable control.
3Productivity
If memory arrays are positioned between consecutive logic tiles, then interconnectivity is improved, but area of logic tile increases
Solution Approach 1:
The patent positions memory arrays in the spatial dimension between logic tiles rather than expanding logic tile area horizontally. By utilizing the vertical and inter-tile spacing dimensions, the design achieves improved interconnectivity through closer proximity of memory to logic components without increasing the footprint or area of individual logic tiles, maintaining compact overall architecture.
Data Source
AI summary
An integrated circuit comprising a first memory array and programmable/configurable logic circuitry including a plurality of logic tiles wherein each logic tile includes a perimeter, a plurality of external I/O disposed in an I/O layout on the perimeter, wherein the I/O layout of each tile is identical. Each external I/O is configurable as an external I/O to connect to and communicate with external circuitry, or a memory I/O to point-to-point connect to memory located adjacent thereto, or an unused I/O. The first memory array is physically adjacent to a first logic tile on a first portion of the perimeter of the first logic tile which is interior to the periphery of the programmable/configurable logic circuitry, and point-to-point connected to the memory I/O. In operation, circuitry of the first logic tile is configured to read data from and write data to the first memory array via the memory I/O.