FPGA Logic Drive Using NVM Cells to Reduce NRE Costs
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Solution Overview
Problem
The high Non-Recurring Engineering (NRE) costs and inefficiencies of current Field Programmable Gate Array (FPGA) IC chips, particularly when transitioning to advanced semiconductor technology nodes, hinder innovation and application development due to larger chip size, higher power consumption, and increased fabrication costs, making it costly to implement advanced IC technology.
Innovation Solution
A standardized commodity logic drive utilizing multiple FPGA IC chips with non-volatile memory cells and SRAM cells, optimized for advanced semiconductor technology nodes, reduces NRE costs by allowing field programming and software development in common programming languages, enabling efficient workload processing and innovative applications at lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If FPGA IC chips are used for field programming purposes, then adaptability and versatility are improved, but chip size, power consumption, and fabrication cost increase
Solution Approach 1:
The patent divides the FPGA chip into multiple logic blocks, each containing lookup tables (LUTs) and flip-flops, that can be independently programmed and configured. This segmentation allows the chip to be divided into functional units that can be selectively activated, reducing the effective area needed for specific applications while maintaining overall adaptability.
Solution Approach 2:
The patent implements universal logic blocks that can be programmed to perform multiple different logic functions through configuration memory. Each logic block contains lookup tables that can be programmed to implement any combinational logic function, making the same physical hardware structure capable of multiple functions, thereby reducing the chip area needed compared to having dedicated hardware for each function.
2Adaptability or versatility
If FPGA IC chips are used for field programming purposes, then adaptability and versatility are improved, but power consumption increases
Solution Approach 1:
The patent employs dynamic reconfiguration capability where the logic blocks and interconnect structures can be programmed and reprogrammed at runtime to adapt to different computational tasks. This dynamic nature allows the system to optimize power consumption by activating only the necessary logic blocks for a given task, rather than maintaining all possible functions active simultaneously.
Solution Approach 2:
The patent implements local interconnect structures that allow signals to be routed only to the specific logic blocks that need them, rather than providing global connectivity to all blocks. This local quality approach reduces the number of active interconnect lines and associated switching elements, thereby reducing overall power consumption while maintaining the ability to reconfigure for different functions.
3Adaptability or versatility
If FPGA IC chips are used for field programming purposes, then adaptability and versatility are improved, but fabrication cost increases
Solution Approach 1:
The patent uses configuration memory (such as SRAM or non-volatile memory) to store the programming data that defines the logic function of each block. This copying approach allows the same physical chip design to be programmed with different logic configurations without requiring different physical masks or fabrication processes, significantly reducing the cost of producing adaptable hardware compared to custom ASIC designs.
Solution Approach 2:
The patent changes the functional parameters of the logic blocks through electrical programming of configuration memory cells, rather than changing the physical structure through different fabrication processes. This parameter change approach allows a single fabrication process to produce chips that can be configured for different applications, avoiding the high costs of multiple fabrication runs or custom mask sets required for ASIC production.
4Productivity
If advanced semiconductor technology nodes are used, then performance is improved, but Non-Recurring Engineering costs increase greatly
Solution Approach 1:
The patent creates a universal platform using advanced technology node FPGA chips that can be programmed to implement multiple different applications and algorithms. This universality allows the high NRE cost of the advanced technology node to be amortized across many different product applications, making the high-performance chip economically viable by sharing the fabrication cost across diverse uses rather than requiring separate custom designs for each application.
Solution Approach 2:
The patent leverages the high-performance characteristics of advanced technology nodes (such as smaller transistor sizes and higher switching speeds) while using programmable logic to adapt the performance parameters to match specific application requirements. This allows the system to achieve high performance when needed while avoiding the NRE cost of designing and fabricating multiple different high-performance ASICs for different applications, as a single reconfigurable chip can serve multiple performance needs.
Data Source
AI summary
A multi-chip package includes: an interposer; a first IC chip over the interposer, wherein the first IC chip is configured to be programmed to perform a logic operation, comprising a NVM cell configured to store a resulting value of a look-up table, a sense amplifier having an input data associated with the resulting value from the NVM cell and an output data associated with the first input data of the sense amplifier, and a logic circuit comprising a SRAM cell configured to store data associated with the output data of the sense amplifier, and a multiplexer comprising a first set of input points for a first input data set for the logic operation and a second set of input points for a second input data set having data associated with the data stored in the SRAM cell, wherein the multiplexer is configured to select, in accordance with the first input data set, an input data from the second input data set as an output data for the logic operation; and a second IC chip over the interposer, wherein the first IC chip is configured to pass data associated with the output data for the logic operation to the second IC chip through the interposer.


