Distributed FPGA Test Module Layout for Multi-Camera Heat Bottlenecks
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Solution Overview
Problem
Existing test systems face challenges with increased data capacity and heat generation due to advanced camera technology, leading to performance bottlenecks, complex heat dissipation structures, and increased costs, as well as data loss and reduced accuracy.
Innovation Solution
A test device and system that integrates a data conversion module and test module on separate substrates, utilizing FPGA boards and PCIe connectors, allowing distributed processing and improved heat dissipation, while maintaining compatibility with conventional frame grabbers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple frame grabbers are connected to a single computer to process test images from multiple cameras, then the data processing capability is improved, but the heat generation from semiconductor chips increases and the computer volume increases due to complex heat dissipation structures
Solution Approach 1:
The system divides the centralized computer into multiple distributed test devices, each handling a subset of frame grabbers. This segmentation distributes the heat generation across multiple independent units rather than concentrating it in one computer, resolving the contradiction between improved data processing capability and reduced heat generation.
Solution Approach 2:
The patent transitions from a single-dimension centralized processing architecture to a multi-dimension distributed architecture where test devices are arranged in a network. This dimensional change allows the system to maintain high data processing capability while distributing thermal loads across spatial dimensions, avoiding the heat accumulation problem of centralized systems.
2Reliability
If the computer processes all data from multiple frame grabbers simultaneously, then comprehensive test coverage is achieved, but a bottleneck phenomenon occurs that deteriorates overall performance
Solution Approach 1:
The test system is segmented into multiple independent test devices, each responsible for processing data from specific frame grabbers. This segmentation eliminates the single-point bottleneck by distributing the processing load across multiple parallel pathways, maintaining comprehensive test coverage while improving overall processing speed through concurrent operations.
Solution Approach 2:
Multiple test devices operate simultaneously and continuously process test data in parallel, eliminating the sequential processing bottleneck. Each test device maintains continuous useful action on its assigned data stream, ensuring both comprehensive test coverage and sustained high processing speed without performance deterioration.
3Temperature
If the distance between semiconductor chips is increased to reduce heat generation, then heat dissipation is improved, but the volume of the computer increases
Solution Approach 1:
By segmenting the system into multiple compact test devices, each with its own semiconductor chips arranged in optimized configurations, the patent achieves effective heat dissipation at the device level without requiring large distances between chips. Each test device can be designed with compact chip arrangements that still maintain adequate thermal management, and the overall system volume is distributed across multiple units rather than requiring one large computer.
Data Source
AI summary
A test device according to an embodiment includes a first substrate including a data conversion module having a first connector for receiving data acquired from an external equipment, an FPGA (Field Programmable Gate Array) for converting the received data, and a second connector for outputting the converted data; a second substrate including a test module including a third connector connected to the second connector of the first substrate and receiving the converted data, a test unit for performing a test operation using the data received through the third connector, a communication unit for transmitting test result information according to a test operation result of the test unit to an outside, and a control unit for controlling the test unit and the communication unit; and a housing for accommodating the first substrate and the second substrate.