FR-4 Reinforcement Board With Through-Hole Grounding
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Solution Overview
Problem
Existing reinforcement boards for flexible printed circuit boards, typically made of steel sheets, are too heavy and cannot meet thickness requirements due to their weight, limiting their application in full-screen and large-screen display devices.
Innovation Solution
A reinforcement board with a substrate having through holes and conductive layers on both surfaces and the hole walls, allowing for electrical conductivity between surfaces, using lightweight materials like FR4 composite, ensuring grounding and connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If steel sheets are used as reinforcement board material, then strength and rigidity are improved, but weight increases and thickness requirement cannot be met
Solution Approach 1:
The patent uses FR-4 composite material (fiberglass reinforced epoxy resin) as the substrate material instead of traditional steel sheets. This composite material provides sufficient mechanical strength and rigidity for reinforcement while being significantly lighter in weight, thus resolving the contradiction between strength and weight requirements.
2Strength
If steel sheets are used as reinforcement board material, then strength is improved, but thickness requirement cannot be met due to weight constraints
Solution Approach 1:
The FR-4 composite material enables the reinforcement board to achieve the required thickness (typically 0.5-2mm) while maintaining sufficient strength. The composite structure provides high strength-to-weight ratio, allowing thickness requirements to be met without compromising mechanical properties.
3Reliability
If through holes are added to the substrate for conductive connection, then electrical conductivity is improved, but structural integrity may be affected
Solution Approach 1:
The patent incorporates through holes in the FR-4 substrate to create conductive pathways for grounding. The FR-4 composite material maintains sufficient structural integrity despite the presence of through holes, as the holes are strategically positioned and sized to provide electrical connectivity without compromising overall substrate strength.
4Reliability
If conductive layers are added on surfaces and hole walls, then electrical conductivity and grounding are improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into the FR-4 substrate: mechanical reinforcement, electrical insulation, and conductive pathway provision. The through holes with conductive layers serve dual purposes of structural reinforcement and electrical grounding, reducing overall device complexity while maintaining reliability.
Data Source
AI summary
A reinforcement board for a flexible printed circuit, a flexible printed circuit assembly, and a display device. The reinforcement board for a flexible printed circuit comprises a substrate; the substrate comprises a first surface and a second surface which are opposite to each other; a through hole passing through the first surface and the second surface is provided on the substrate; the first surface, the second surface, and the wall of the through hole are all provided with a conductive layer; and the conductive layers on the first surface and the second surface are connected by means of the conductive layer on the wall of the through hole.