Fragmented Marking on Substrate with 2D Structure
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Solution Overview
Problem
Current anti-counterfeiting solutions for goods, especially pharmaceuticals, lack robustness and uniqueness, making them vulnerable to reproduction and failure to provide effective track and trace information, posing significant risks to consumers and revenue loss.
Innovation Solution
A substrate with a fragmented marking system where a two-dimensional structure is attached, featuring a marking that is partially on the substrate and partially on the structure, utilizing techniques like laser printing with varying intensity and frequency to create unique, tamper-proof codes and color-shift effects, ensuring the marking is difficult to replicate and detectable even after the structure is removed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a two-dimensional structure is attached to the substrate with a fragmented marking system, then security and anti-counterfeiting capability are significantly enhanced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The marking is divided into multiple fragmented parts distributed across different locations on the substrate and the two-dimensional structure. This segmentation ensures that no single component contains the complete information, making counterfeiting significantly more difficult while maintaining manageable individual components
Solution Approach 2:
The two-dimensional structure is attached to the substrate in such a way that it contains embedded marking information, while the substrate itself also contains marking information. The structures are nested together to form a integrated security system where each level contributes to the overall security
2Reliability
If laser printing with varying intensity and frequency is used to create unique codes and color-shift effects, then marking uniqueness and tamper-proof properties are improved, but manufacturing precision requirements increase
Solution Approach 1:
The laser printing process utilizes variations in laser intensity, pulse duration, and frequency to create distinct marking characteristics. These parameter changes produce unique codes and color-shift effects that are difficult to replicate, enhancing tamper-proof properties while using controllable manufacturing parameters
3Reliability
If the marking is distributed across both the substrate and the two-dimensional structure, then authentication robustness is enhanced, but ease of manufacture decreases
Solution Approach 1:
The marking information is segmented and distributed across the substrate and the two-dimensional structure. This allows each component to be manufactured separately with standard processes, then assembled together to form the complete security system, balancing authentication robustness with manufacturing ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances security by making it extremely difficult to counterfeit or tamper with the substrate, as the marking is distributed across the substrate and structure, ensuring authenticity and detectability, thus protecting consumers and maintaining revenue integrity.
Implementation Method 1
The marking may have been provided by a printing process such as, e.g., a laser printing process
Implementation Method 2
The intensity of the laser, the scanning speed of the laser beam, the laser pulse duration and the laser pulse frequency may have been varied during the printing process
Implementation Method 3
the two-dimensional structure may comprise a color-shift layer on at least a part of its surface that is opposite to the substrate
Data Source
AI summary
Disclosed is a substrate with a marking thereon. A part of the substrate has a two-dimensional structure attached thereto, and a part of the marking is present on the structure and the other part of the marking is present on the substrate itself.