Frame-Array Interconnects for IC Package Footprint Reduction
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Solution Overview
Problem
Integrated-circuit chip miniaturization poses challenges in fitting sufficient passive devices near semiconductive devices on semiconductor package substrates due to competition for both vertical and lateral space, necessitating innovative interconnect solutions for efficient power and signal delivery.
Innovation Solution
The implementation of frame-array interconnects, which replace traditional ball-grid array interconnects, allows for the seating of passive devices like capacitors between electrode elements, facilitating smaller inductive loops and reduced package footprints, thereby optimizing space utilization and signal delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional ball-grid array interconnects are used, then package footprint is larger, but space utilization is less efficient
Solution Approach 1:
The patent transitions from a planar ball-grid array interconnect to a three-dimensional frame-array interconnect structure. The frame-array includes vertical posts extending from the substrate surface, creating multiple height levels (z-dimension) for component placement. This dimensional change allows passive devices to be mounted on the vertical surfaces of the frame, effectively utilizing vertical space and reducing the horizontal footprint while maintaining high space utilization.
2Reliability
If passive devices are placed near semiconductive devices, then power delivery efficiency improves, but space competition increases
Solution Approach 1:
The frame-array interconnect structure provides vertical surfaces and multiple height levels that allow passive devices to be positioned in the z-dimension rather than competing for horizontal space. This enables decoupling capacitors and other passive components to be placed in close proximity to semiconductive devices for optimized power delivery, while the vertical arrangement prevents lateral space competition.
Solution Approach 2:
The frame-array structure creates a nested configuration where passive devices are positioned within and around the three-dimensional frame structure. The frame posts and cross-members form a scaffold that holds multiple passive devices in close proximity to the semiconductor die, enabling efficient power delivery networks without requiring additional lateral space.
3Area of stationary object
If package footprint is reduced, then integration density increases, but inductive loop size may increase
Solution Approach 1:
The frame-array interconnect uses vertical posts and multi-level structure to create compact current return paths in the z-dimension. This three-dimensional arrangement allows for smaller inductive loops by providing direct vertical return paths through the substrate, compensating for the reduced horizontal space available for trace routing.
Data Source
AI summary
Disclosed embodiments include frame-array interconnects that have a ledge portion to accommodate a passive device. A seated passive device is between at least two frame-array interconnects for semiconductor package-integrated decoupling capacitors.