Frame-Shaped Electrode Suppresses Resin Flow in Built-In Component Substrates
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Solution Overview
Problem
Substrates with built-in components face issues of wiring-conductor and via defects due to resin flow during thermocompression bonding, especially when wiring in the periphery of the built-in component is finer and denser, leading to open and short defects.
Innovation Solution
Encircling the periphery of the built-in component with frame-shaped electrodes to suppress resin flow during thermocompression bonding, thereby reducing and preventing wiring-conductor and via defects, and optionally connecting the frame-shaped electrodes to the ground for electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermocompression bonding is performed to bond resin sheets, then the substrate with built-in component is formed, but wiring conductors and vias are displaced and open defects and short defects occur due to resin flow
Solution Approach 1:
The invention introduces a resin non-flow region (formed by recesses or protrusions in the resin sheet) before thermocompression bonding to pre-determine where resin will not flow. This preliminary structural arrangement prevents resin from flowing into critical areas during bonding, thereby protecting wiring conductors and vias from displacement and defect formation while still allowing the substrate to be formed through thermocompression bonding
2Adaptability or versatility
If wiring in the periphery of the built-in component is made finer and denser, then the substrate functionality is improved, but resin flow causes more frequent open and short defects
Solution Approach 1:
The invention applies local quality by creating a resin non-flow region specifically in the peripheral area where finer and denser wiring exists. The recess or protrusion is positioned to correspond to the wiring conductor or via, providing localized protection only where needed. This allows the substrate to achieve improved functionality with fine peripheral wiring while maintaining high reliability by preventing resin-induced defects in those critical fine wiring regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces and prevents wiring-conductor and via defects by controlling resin flow, while also providing electromagnetic shielding when frame-shaped electrodes are connected to the ground.
Implementation Method 1
The resin flow occurring in an outer side portion of the frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode
Implementation Method 2
optionally connecting the frame-shaped electrodes to the ground for electromagnetic shielding
Data Source
AI summary
A substrate includes a built-in component that suppresses resin flow occurring in the case of thermocompression bonding in a region where vias and wiring conductors are provided and that reduces the occurrence of via defects and wiring-conductor defects. The resin flow occurring in an outer side portion of a frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode. Because of this structure, the occurrence of defects in vias and wiring conductors arranged in an outer side portion of the frame-shaped electrode may be reduced.