Semiconductor Package Frame Ring Overhangs for Warpage Control
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Solution Overview
Problem
The integration of multiple semiconductor devices in miniaturized electronic systems faces challenges in achieving lower transmission and insertion losses while maintaining mechanical stability and preventing delamination or cracking, which affects the yield and reliability of semiconductor devices.
Innovation Solution
The use of frame rings with overhangs on the circuit substrate to encircle semiconductor dies, reducing warpage and mechanical stress, and allowing for heavier or larger frame rings without area penalties, thereby enhancing mechanical stability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor devices are integrated in miniaturized electronic systems, then device density and functionality are improved, but mechanical stability deteriorates and transmission loss increases
Solution Approach 1:
The patent introduces frame rings with overhang structures that extend in the lateral dimension beyond the semiconductor die boundaries. This dimensional extension provides mechanical support without increasing the vertical stacking density, thereby maintaining device integration density while improving mechanical stability through the overhang portions that anchor to the substrate.
Solution Approach 2:
The frame rings serve as intermediary structures between the semiconductor dies and the substrate. These frame rings with overhangs act as mechanical mediators that distribute stress and prevent direct contact between adjacent dies, reducing transmission loss and improving mechanical stability without compromising integration density.
2Reliability
If frame rings are added to encircle semiconductor dies, then mechanical stability is improved, but device area increases
Solution Approach 1:
The frame rings are positioned locally around each semiconductor die or group of dies, providing mechanical support only where needed at the die peripheries. The overhang portions extend locally beyond the die boundaries to anchor into the substrate, delivering mechanical stability without encircling the entire circuit substrate and thus avoiding unnecessary area increase.
Solution Approach 2:
The circuit substrate is segmented into multiple regions, each with its own frame ring structure enclosing specific semiconductor dies. This segmentation allows frame rings to be added selectively to high-stress areas rather than uniformly across the entire substrate, improving mechanical stability where needed while minimizing the total area occupied by frame structures.
3Stability of the object's composition
If heavier or larger frame rings are used, then warpage reduction is improved, but manufacturing complexity increases
Solution Approach 1:
The frame ring structures utilize parameter changes in the overhang dimensions and material composition to achieve effective warpage control. By adjusting the overhang length, width, and anchoring depth within optimized ranges, sufficient mechanical support is provided to reduce warpage without requiring excessively heavy or large frame rings that would complicate manufacturing.
Solution Approach 2:
The frame rings are constructed using composite material systems that combine materials with different mechanical properties to achieve effective warpage control. This composite approach allows lighter frame structures with optimized mechanical performance, reducing manufacturing complexity compared to using uniformly heavy materials while still achieving the required warpage reduction.
Data Source
AI summary
A semiconductor device includes a circuit substrate, at least one semiconductor die, a first frame, and a second frame. The at least one semiconductor die is connected to the circuit substrate. The first frame is disposed on the circuit substrate and encircles the at least one semiconductor die. The second frame is stacked on the first frame. The first frame includes a base portion and an overhang portion. The base portion has a first width. The overhang portion is disposed on the base portion and has a second width greater than the first width. The overhang portion laterally protrudes towards the at least one semiconductor die with respect to the base portion. The first width and the second width are measured in a protruding direction of the overhang portion.