Frameless Display Panel With Hidden Bonding Connections
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Solution Overview
Problem
Conventional display panels, such as organic light emitting diode (OLED) panels, require a frame to cover the bonding region, preventing a full screen display.
Innovation Solution
Employ a second substrate on the light exiting side to cover the first substrate's bonding portion, utilizing a second bonding portion to connect with a flexible circuit substrate, allowing for a full screen display without a frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a frame is used to cover the bonding region, then the bonding region is protected and structurally supported, but the full screen display cannot be realized
Solution Approach 1:
The patent applies nesting by placing the first bonding portion inside the bonding region of the second substrate. The first substrate's bonding area is embedded within the second substrate's structure, allowing the bonding function to be hidden inside the display panel rather than requiring an external frame to cover it.
Solution Approach 2:
The patent moves the bonding region from the external periphery (2D plane) to the internal layered structure (3D depth). By positioning the first bonding portion at a different spatial layer within the second substrate, the bonding function is achieved without occupying the display area on the front surface.
2Area of moving object
If the first substrate's bonding portion is exposed, then the bonding can be performed, but a frame is required to cover it which reduces the display area
Solution Approach 1:
The first bonding portion is nested within the second substrate's bonding region, hiding the bonding connection inside the panel structure. This eliminates the need for a frame while maintaining the bonding reliability through proper internal positioning and connection.
Solution Approach 2:
The second substrate acts as an intermediary that mediates between the first substrate's bonding needs and the desire for full screen display. It provides a platform to host the bonding connection internally while presenting a clean front surface for maximum display area.
3Reliability
If conductive pads are connected through the second substrate, then electrical stability is enhanced, but the structure becomes more complex
Solution Approach 1:
The patent merges the electrical connection function with the structural substrate by integrating conductive pads directly into the second substrate. This combines multiple functions (structural support and electrical connection) into a single component, reducing overall complexity while enhancing electrical stability.
Solution Approach 2:
The second substrate is designed to serve multiple functions simultaneously: it provides structural support, hosts the bonding region, and incorporates conductive pads for electrical connections. This multi-functionality reduces the need for separate components, simplifying the overall structure while achieving electrical stability.
Data Source
AI summary
An embodiment of the present application discloses a display panel. In the display panel, a first substrate includes a first bonding portion. The first bonding portion corresponds to a non-display region. A second substrate is located on a light exiting side of the display panel, and the second substrate includes a second bonding portion. The second bonding portion covers the first bonding portion. An end of the second bonding portion is bonded and connected to the first bonding portion. A flexible circuit substrate is bonded and connected to another end of the second bonding portion.