Frameless Modular Assembly for Durable Slide-In Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Modular computing devices face challenges in ease of module insertion and removal, durability, and are limited by their frame or structure, making them unsuitable for everyday use and limiting device type and size.
Innovation Solution
A frameless modular electronic device comprising a base module and interchangeable component modules connected via a connecting member, allowing for slidably aligned assembly without a frame, with an electrical interface for data and energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If modules are designed to be easily inserted and removed, then ease of operation is improved, but durability deteriorates
Solution Approach 1:
The device is divided into separate functional modules that can be independently inserted and removed. Each module contains specific components (processor, display, battery, etc.) that can be reconfigured based on user needs, enabling easy customization while maintaining connection integrity through standardized interfaces.
Solution Approach 2:
The connecting member is designed with universal compatibility across different module types, featuring standardized electrical contacts and mechanical coupling elements that work with various module configurations. This allows the same connection mechanism to serve multiple functions: electrical connection, mechanical support, and alignment guidance.
2Reliability
If a frame or structure is used to house modules, then durability is improved, but adaptability deteriorates
Solution Approach 1:
The device configuration is made dynamic and reconfigurable rather than fixed. Modules can be added, removed, or rearranged to change device functionality and form factor. The connecting member enables this dynamic reconfiguration while maintaining structural integrity during use, allowing the device to adapt to different usage scenarios.
Solution Approach 2:
Multiple functional modules are nested together through hierarchical connection, with base modules providing core functionality and additional component modules extending capabilities. This nested architecture allows compact arrangement of components while maintaining accessibility for individual module replacement or reconfiguration.
3Manufacturing precision
If precision alignment is required for module connection, then manufacturing precision is improved, but ease of operation deteriorates
Solution Approach 1:
The connecting member incorporates asymmetric alignment features such as guide pins, shaped interfaces, or directional engagement elements that provide tactile and visual guidance for proper module orientation. This asymmetric design naturally guides users into the correct alignment position, eliminating the need for high-precision manual alignment while ensuring repeatable connection geometry.
Solution Approach 2:
The alignment and connection process is simplified by replacing complex mechanical adjustment mechanisms with self-aligning features. Magnetic attraction, spring-loaded contacts, or flexible connection elements automatically compensate for minor positioning variations, reducing the precision requirement for manual insertion while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy assembly and disassembly of modular devices, enhancing durability and flexibility in size and functionality, allowing for a wide range of device configurations without structural constraints.
Implementation Method 1
the connecting member includes a magnet to secure the connecting member when assembled
Data Source
AI summary
The present technology discloses a frameless modular multi-functional electronic device. The electronic device includes a base module with a processor and multiple component modules, at least one of which is configured to connect directly in contact with the base module. The modules each include a connecting member to slidably align and mate the component modules together, and an electrical interface to transmit digital information and energy between connected base and component modules. The component modules are interchangeably connected directly in contact with each other and, when assembled, form the frameless modular multi-functional electronic device.


