3D Framework Heat Sink Structure for Electronic Component Cooling
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Solution Overview
Problem
Existing electronic devices face challenges in achieving effective heat dissipation, leading to increased temperatures and potential performance issues due to limited heat transfer capabilities of conventional heat dissipation methods.
Innovation Solution
A heat dissipation member with a multi-layer, framework structure featuring a three-dimensional lattice shape is integrated into the electronic device, providing a larger contact area with air and enhanced thermal conductivity, which includes a first extending portion, a second extending portion, and a plurality of third extending portions connected via frames, allowing for improved heat transfer from the electronic component to the air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat dissipation member is used, then the structure is simple and easy to manufacture, but the heat dissipation performance is insufficient and the contact area with air is limited
Solution Approach 1:
The heat dissipation member transitions from a conventional two-dimensional flat structure to a three-dimensional framework structure with multiple extending portions (first, second, and third extending portions) that extend in different directions. This dimensional change increases the contact area with air and improves heat dissipation performance by exposing more surface area to the surrounding environment for thermal exchange.
Solution Approach 2:
The heat dissipation member is divided into multiple segmented extending portions (first extending portion, second extending portion, and plurality of third extending portions) that are positioned at different locations and orientations. Each segment independently contacts air, and the segments are connected by frames to form a cohesive framework structure that maximizes heat dissipation while maintaining structural integrity.
2Weight of moving object
If a solid heat dissipation member is used, then the structural strength is high, but the weight is increased and flexibility is reduced
Solution Approach 1:
The heat dissipation member employs a framework structure with intentional voids and spaces between the extending portions and frames, creating a porous configuration. This porous design reduces the amount of material required, thereby decreasing weight, while the distributed framework architecture maintains structural strength by providing multiple load-bearing pathways and preventing stress concentration in any single location.
Solution Approach 2:
The heat dissipation member is constructed as a composite framework combining multiple extending portions and frames that work together to provide both structural support and thermal dissipation functions. The composite structure integrates different geometric elements (extending portions for heat dissipation, frames for structural support) to achieve optimal balance between weight, strength, and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in higher heat dissipation performance, reduced weight, and increased flexibility of the heat dissipation member, effectively lowering the temperature of electronic components and improving overall device cooling efficiency while simplifying manufacturing processes.
Implementation Method 1
The heat dissipation member is thermally connected to the first electronic component... improved heat transfer from the electronic component to the air
Implementation Method 2
The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions... providing a larger contact area with air
Data Source
AI summary
According to one embodiment, an electronic device according to an embodiment includes, for example, a board, a first electronic component, and a heat dissipation member. The board includes a first face. The heat dissipation member is disposed at a side opposite to the first face of the first electronic component. The heat dissipation member is thermally connected to the first electronic component. The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions. The first extending portion extends along the first face. The second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space. The second extending portion extends along the first face. The plurality of the third extending portions are connected to the first extending portion and the second extending portion. The plurality of the third extending portions are positioned away from each other by a space.