Free Space Optical Circuit Board Testing System
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Solution Overview
Problem
Existing systems for testing circuit boards, particularly those conforming to PCI Industrial Computer Manufacturers Group standards like AdvancedTCA or MicroTCA, face limitations due to inadequate numbers of connector pin and aperture mating pairs, leading to slow testing times, limited high-volume testing feasibility, and an inability to perform full test protocols effectively.
Innovation Solution
The implementation of an optical communication link across free space between circuit boards attached to a backplane, utilizing optical signal transmitters and receivers to facilitate circuit board test signal communication, thereby bypassing traditional electronic communication pathways and enhancing testing efficiency and capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional electronic communication pathways through backplane connectors are used, then system structure is simple and reliable, but testing speed and bandwidth are insufficient
Solution Approach 1:
The patent replaces traditional electronic communication pathways (mechanical/electrical connectors and traces) with optical communication pathways using light. Optical transmitters convert electrical test signals to optical signals that travel through free space between circuit boards, and optical receivers convert them back. This substitution provides significantly higher bandwidth and faster testing speeds while maintaining system reliability through established optical technology.
Solution Approach 2:
The patent introduces optical transmitters and optical receivers as intermediary devices between circuit boards. These intermediaries convert electrical signals to optical signals for transmission and back to electrical signals for processing. This intermediary approach enables faster communication while keeping the original electrical interfaces on the circuit boards unchanged, thus resolving the contradiction between speed improvement and system complexity.
2Productivity
If more connector pin and aperture mating pairs are used to increase testing capacity, then testing bandwidth increases, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent replaces the mechanical connector system with optical free-space communication. Instead of adding more physical connector pins and apertures to increase bandwidth, the system uses optical transmitters and receivers that communicate through light in free space. This provides dramatically increased testing capacity without any additional mechanical complexity or manufacturing difficulty associated with more connector mating pairs.
3Speed
If optical communication link is implemented, then testing speed and bandwidth increase, but system complexity increases
Solution Approach 1:
The patent uses optical transmitters and receivers as intermediary devices that handle the complexity of optical communication. These intermediaries are mounted on existing circuit boards and manage signal conversion, alignment, and transmission. By confining the optical complexity to these dedicated intermediary components rather than distributing it throughout the entire system, the patent achieves high-speed data transfer while keeping overall system complexity manageable.
Solution Approach 2:
The optical transmitters and receivers serve multiple functions: they act as electrical-to-optical signal converters, provide free-space transmission capability, enable high-bandwidth communication, and maintain backward compatibility with existing electrical interfaces. This multi-functionality justifies the added complexity by delivering comprehensive benefits across multiple performance dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more efficient circuit board testing, supports high-volume testing, and improves the quality of testing protocols, overcoming the limitations of conventional systems by providing increased bandwidth and data transfer speed.
Implementation Method 1
The first optical signal transmitter and the first optical signal receiver are separated by free space and form an optical communication link configured for circuit board test signal communication from the first circuit board to the second circuit board through the free space
Data Source
AI summary
System including backplane, and first and second circuit boards. First circuit board is attached to backplane and has first optical signal transmitter. Second circuit board is attached to backplane and has first optical signal receiver. First optical signal transmitter and first optical signal receiver are separated by free space and form optical communication link configured for circuit board test signal communication from first circuit board to second circuit board through the free space. Method includes providing backplane and first and second circuit boards, where first circuit board is attached to backplane and has first optical signal transmitter, and second circuit board is attached to backplane and has first optical signal receiver. First optical signal transmitter and first optical signal receiver are separated by free space, and form optical communication link. Method additionally includes transmitting circuit board test signal from first circuit board to second circuit board through the free space.