Free-Space Optoelectronic Module Footprint Reduction
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Solution Overview
Problem
Existing optoelectronic modules for contactless free-space optical links face challenges in reducing footprint on electronic boards, maintaining high throughput signal conversion, ensuring compatibility with imperfect alignment, and operating in harsh environments with low electrical consumption, particularly in applications like aeronautical and medical fields.
Innovation Solution
An optoelectronic module design featuring a stack of bare electronic and optoelectronic components directly attached to a printed circuit board, with an optical device and lens support for mechanical alignment, allowing for compact footprint and efficient signal conversion, and using reference marks for precise alignment, enabling effective transmission over varying distances and misalignment tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fiber is used within TOSA or ROSA modules, then reliable optical signal transmission is achieved, but the footprint on the application board becomes too large for compact applications
Solution Approach 1:
The patent extracts and removes the optical fiber from the module structure, replacing it with a free-space optical link between transmitter and receiver modules. This eliminates the space-consuming optical fiber routing while maintaining optical signal transmission capability, thereby reducing the module footprint to under 100 mm².
Solution Approach 2:
The patent transitions from a contact-based optical fiber connection (1D/2D space occupation) to a free-space optical link (3D space utilization). By transmitting optical signals through air or vacuum between modules, the system eliminates the need for physical fiber routing within the module, significantly reducing the required footprint while maintaining transmission reliability.
2Area of stationary object
If the module footprint is reduced to less than 100 mm², then compactness is improved for aeronautical applications, but alignment tolerance becomes more critical and connection complexity increases
Solution Approach 1:
The patent incorporates alignment marks and positioning features directly into the module structure during manufacturing. These pre-established reference elements enable precise alignment during installation without requiring complex real-time adjustment mechanisms, thereby achieving the necessary alignment tolerance while maintaining compact dimensions.
Solution Approach 2:
The module design includes self-aligning features such as mechanical guides and reference marks that automatically facilitate correct positioning during installation. This self-service alignment mechanism reduces the need for complex external alignment tools and procedures, making the compact module easier to install despite tight tolerance requirements.
3Productivity
If electrical links are used for high-density channels, then signal transmission is achieved, but electromagnetic interference increases and signal quality deteriorates at high frequencies
Solution Approach 1:
The patent replaces electrical signal transmission through conductors with optical signal transmission through free space. This substitution eliminates electromagnetic interference inherent in electrical links, as optical signals do not generate or suffer from electromagnetic interference, thereby maintaining signal quality even at high frequencies and high channel densities.
4Reliability
If optical fiber connections are implemented, then high throughput signals are transmitted reliably, but weight and production costs of modules increase
Solution Approach 1:
The patent removes the optical fiber component from the module structure, replacing it with a free-space optical transmission path. This extraction eliminates the weight of the fiber optic cables and their associated connectors and routing infrastructure, significantly reducing module weight while maintaining high throughput signal transmission capability through direct optical coupling between transmitter and receiver.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a significantly reduced footprint, high throughput signal transmission, and compatibility with harsh environments, while minimizing electrical consumption and simplifying installation and reconfiguration, making it suitable for small board-to-board distances and diverse applications.
Implementation Method 1
an optoelectronic component suitable for transmitting or receiving a light signal
Implementation Method 2
an optical device suitable for transmitting an optical signal
Data Source
AI summary
An optoelectronic module, intended to provide a conversion of an electrical signal from an electronic board into an optical signal propagated in free space or vice versa, includes the following stack: an electronic board, intended to act as an interface with an electronic application board; an electronic control component suitable for controlling an optoelectronic component, the electronic component being attached directly onto the electronic board and electrically connected to the electronic circuit; an optoelectronic component suitable for transmitting or receiving a light signal via its upper surface, the optoelectronic component being attached directly on the top of the electronic control component and electrically connected to the electronic component; an optical device suitable for transmitting an optical signal; an optical device support, the support being attached, preferably by gluing or brazing, directly onto the electronic board so as to ensure the mechanical alignment between the optical device and the optoelectronic component.