Free-Form Surface Coupler for Laser-to-Waveguide Chip Integration

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current methods for interconnection between on-chip lasers and silicon-based optoelectronic chips, such as grating diffraction and oblique reflection, result in lower integration level and coupling efficiency, limiting the development of optical systems.

Innovation Solution

An optoelectronic chip integrated system utilizing a free-form surface coupler to connect a laser and a chip, featuring a waveguide structure, where the coupler converts light beam transmission direction and mode to align with the waveguide, enhancing integration and coupling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If grating diffraction or oblique reflection methods are used for interconnection, then the laser can be connected to the chip, but the integration level and coupling efficiency are reduced

Engineering Contradiction:
Improvecoupling efficiencyVSAvoidintegration level
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a free-form surface coupler with a curved reflective surface to transform the vertical light beam from the laser into a horizontally propagating beam that matches the waveguide mode. The curved surface geometry enables precise control of light reflection angles and mode transformation, achieving high coupling efficiency while maintaining compact integration.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The free-form surface coupler acts as an intermediary component between the laser and the waveguide structure. It mediates the transition of light from vertical propagation mode to horizontal waveguide mode through reflective transformation, solving the mode mismatch problem without requiring complex direct coupling structures.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If existing interconnection methods are used, then the system can be assembled, but the stability and efficiency are reduced

Engineering Contradiction:
Improvesystem stabilityVSAvoidinterconnection efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The free-form surface coupler is pre-designed and fabricated with optimized curvature parameters before assembly. The reflective surface geometry is carefully engineered in advance to achieve precise mode transformation and alignment with the waveguide, ensuring high coupling efficiency and system stability without requiring complex adjustment during assembly.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves high integration level, stability, and efficiency by converting light beam direction and mode to meet chip requirements, overcoming limitations of existing interconnection methods.

Implementation Method 1

a free-form surface coupler on a light path of the light beam emitted from the laser, and configured to receive, reflect and shape the light beam

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

a chip connected with the laser, and including a waveguide structure, where the waveguide structure is connected with the free-form surface coupler, and is configured to receive the reflected and shaped light beam

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS20250233383A1Optoelectronic chip integrated system and manufacturing method thereof
Publication Date: 2025.07.17 ZHEJIANG LAB
  • US20250233383A1 patent drawing
  • US20250233383A1 patent drawing
  • US20250233383A1 patent drawing

AI summary

The present application provides an optoelectronic chip integrated system and manufacturing method thereof. The optoelectronic chip integrated system includes a laser, a free-from surface coupler, and a chip. The laser is configured to emit a light beam. The free-form surface coupler is on a light path of the light beam emitted from the laser, and is configured to receive, reflect and shape the light beam. The chip is connected with the laser, and includes a waveguide structure, where the waveguide structure is connected with the free-form surface coupler, and is configured to receive the reflected and shaped light beam.