Frequency-Dependent Netlist for 2.5D IC Coupling Analysis
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Solution Overview
Problem
Conventional simulation software fails to analyze the electrical coupling between integrated circuits (ICs) and interposers effectively, leading to degraded performance due to capacitive and inductive coupling, especially when misalignment occurs during semiconductor processing.
Innovation Solution
The creation of technology files and netlists that account for electrical coupling between dies and interposers, using existing electronic design automation (EDA) tools, which include resistance-capacitance (RC) tech files and netlists to simulate and optimize the placement of conductors, reducing coupling effects through capacitive and inductive modeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional simulation software is used, then the simulation process is simple, but the analysis of electrical coupling between ICs and interposers is inaccurate
Solution Approach 1:
The patent segments the electrical coupling analysis into frequency-dependent components by creating separate netlists for different frequency ranges. This allows conventional simulation tools to handle each frequency segment independently while achieving accurate overall coupling analysis that would be impossible with a single conventional simulation run.
Solution Approach 2:
The patent introduces an intermediary processing step that converts S-parameter data into frequency-dependent netlists. This intermediary representation enables conventional simulation software to accurately model electrical coupling effects without requiring new simulation engines, thus improving analysis accuracy while maintaining compatibility with existing tools.
2Measurement precision
If frequency-dependent netlists are created, then electrical coupling analysis is accurate, but the processing complexity increases
Solution Approach 1:
The patent performs preliminary actions by pre-processing S-parameter data into frequency-dependent netlists before the main simulation. This preprocessing step organizes the complex coupling data into manageable frequency segments, making subsequent simulations more efficient and enabling parallel processing of different frequency ranges.
Solution Approach 2:
The patent changes the parameter representation of electrical coupling from a single static model to multiple frequency-dependent parameters. By organizing coupling data across different frequency ranges, the system achieves accurate coupling analysis while enabling efficient simulation through parameter-based modeling rather than full-wave electromagnetic simulation at each frequency point.
3Reliability
If misalignment coupling is not modeled, then the design process is faster, but the performance prediction is inaccurate
Solution Approach 1:
The patent performs preliminary modeling of misalignment coupling effects during the netlist creation phase. By incorporating misalignment scenarios into the frequency-dependent netlists before simulation, the system predicts performance impacts without requiring additional simulation runs, thus maintaining design cycle speed while improving prediction accuracy.
Solution Approach 2:
The patent creates copied representations of the interposer and die structures with intentional misalignments to model coupling effects. These copied models are processed into frequency-dependent netlists that capture misalignment coupling behavior, enabling accurate performance prediction without requiring physical prototypes or lengthy measurements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved performance of 2.5D IC packages by accurately modeling and minimizing electrical coupling, thereby optimizing the placement of dies on interposers and reducing the impact of misalignment, without requiring new simulation engines.
Implementation Method 1
The netlist includes data approximating at least one of capacitive or inductive coupling between conductors in the at least one die and in the interposer
Implementation Method 2
The netlist includes data approximating at least one of capacitive or inductive coupling between conductors in the at least one die and in the interposer
Data Source
AI summary
A method includes creating a technology file including data for an integrated circuit including at least one die including at least one metal layer to be formed using at least one of a single patterning process or a multi-patterning process, creating a netlist including data approximating at least one of capacitive or inductive couplings between conductors in the metal layer of at least one die based on the technology file, simulating a performance of the integrated circuit based on the netlist, adjusting the routing between the at least one die and the interposer based on the simulation to reduce the at least one of the capacitive or the inductive couplings, and repeating the simulating and adjusting to optimize the at least one of the capacitive or inductive couplings.