Frequency Divider ESD Protection Using Interconnect Width
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuits face challenges in effectively protecting against electrostatic discharge (ESD) events without the need for conventional ESD protection circuits, which often require clamping devices and additional circuit elements.
Innovation Solution
A frequency divider structure is implemented using interconnect lines of varying widths and cross-sectional areas, where a wider line conducts low-frequency ESD signals to ground and narrower lines conduct high-frequency signals to the integrated circuit, leveraging the skin effect to manage electrical resistance and current flow without the need for clamping devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional ESD protection circuits with clamping devices are used, then ESD protection is provided, but device complexity increases
Solution Approach 1:
The patent extracts the ESD protection function from conventional complex protection circuits and implements it through a simplified frequency divider structure using only interconnect lines. The wider interconnect line selectively conducts low-frequency ESD signals to ground while narrower lines conduct high-frequency signals to the integrated circuit, eliminating the need for clamping devices and additional circuit elements.
Solution Approach 2:
The patent replaces the mechanical/electronic switching mechanism of conventional ESD protection circuits (using silicon-controlled rectifiers and clamping devices) with an electromagnetic field-based frequency selective conduction mechanism. The interconnect lines inherently separate ESD currents based on frequency characteristics without requiring active switching components.
2Device complexity
If frequency selective conduction is implemented, then ESD protection is simplified, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by creating interconnect lines with different local properties - specifically, different cross-sectional areas or widths. The wider interconnect line is designed with dimensions optimized for conducting low-frequency ESD signals, while narrower interconnect lines are optimized for high-frequency signals. This local differentiation in geometric properties enables frequency selective conduction without requiring complex control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides effective ESD protection to integrated circuits by selectively routing low-frequency ESD currents to ground and high-frequency signals to the circuit, enhancing protection without requiring silicon-controlled rectifiers or other circuit elements, thus simplifying the protection mechanism.
Implementation Method 1
leveraging the skin effect to manage electrical resistance and current flow without the need for clamping devices
Data Source
AI summary
Structures for a frequency divider, methods of fabricating a frequency divider, and method of using a frequency divider. A first interconnect line is configured to selectively conduct a first signal of a first frequency. A second interconnect line is coupled with the first interconnect line. The second interconnect line is configured to selectively conduct a second signal of a second frequency. The first frequency is less the second frequency.