3D Frequency Reflecting Unit With Angled Vias
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Solution Overview
Problem
Conventional frequency reflectors for portable electronic devices require additional capacitors and inductors to lower band-pass and band-stop frequencies, increasing the device's size and limiting their application.
Innovation Solution
A frequency reflecting unit with a three-dimensional structure, featuring a metal pattern and vias that form non-zero angles, inducing equivalent capacitors and inductors between neighboring units, eliminating the need for additional surface-mounted components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If additional capacitors and inductors are attached onto the two-dimensional surface to lower band-pass frequencies, then the frequency selectivity is improved, but the area of the frequency reflector increases
Solution Approach 1:
The patent transitions from a two-dimensional frequency reflector structure to a three-dimensional structure by introducing vias that extend vertically through the dielectric substrate. The metal patterns are arranged in multiple layers at different heights, creating a vertical dimension that enables frequency adjustment without increasing the horizontal footprint. This dimensional transformation allows the frequency reflector to achieve lower band-pass frequencies while maintaining a compact area suitable for portable electronic devices.
2Object-affected harmful factors
If a metal radome is used to implement the frequency reflector, then the frequency shielding performance is improved, but the size becomes too large for portable electronic apparatuses
Solution Approach 1:
The patent divides the continuous metal radome structure into discrete, periodically arranged metal patterns (such as cross-shaped or U-shaped patterns) on dielectric substrates. This segmentation allows the frequency reflector to achieve electromagnetic shielding through periodic structures that interact with specific frequency ranges, rather than requiring a solid metal barrier. The segmented design dramatically reduces the overall size and weight while maintaining effective frequency selectivity and shielding performance for portable applications.
Solution Approach 2:
The patent employs composite structures combining metal patterns with dielectric substrates to create the frequency reflector. The metal patterns provide electromagnetic interaction and frequency selectivity, while the dielectric substrates provide structural support and electrical insulation. This composite approach enables the frequency reflector to achieve radome-level shielding performance in a miniaturized form factor suitable for portable electronic devices, avoiding the need for large solid metal radomes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for reduced size and effective frequency adjustment, preventing electronic apparatus circuitry from environmental noise interference while maintaining performance.
Implementation Method 1
Since an equivalent capacitor and an equivalent inductor are induced between the vias of neighboring frequency reflecting units
Implementation Method 2
The frequency characteristics of the frequency reflector depend on the interactions between the periodically arranged metal patterns and electromagnetic waves
Implementation Method 3
the frequency reflector exhibits excellent selectivity with respect to the electromagnetic waves within the band-pass frequencies, while reflecting the electromagnetic waves within the band-stop frequencies
Data Source
AI summary
A frequency reflecting unit is provided. The frequency reflecting unit is used as a portion of a frequency reflector. The frequency reflecting unit with a three-dimensional structure includes a metal pattern and at least one via. The metal pattern is disposed on a metal layout layer defined on one side of the frequency reflecting unit. One end of the via is disposed corresponding to the metal pattern. The via forms a non-zero angle with the metal layout layer. The other end of the via is an open circuit.