Friction Material Mounting for Optical Waveguide Alignment
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Solution Overview
Problem
Achieving high precision positional alignment and suppressing relative movement between a light emitting member and a substrate with an optical waveguide during mounting is challenging due to the need for precise alignment of the light emitting component with respect to the optical waveguide, while maintaining electrical continuity and stability.
Innovation Solution
A light emitting member mounting method that uses friction materials to suppress relative movement between the substrate and the light emitting member, combined with active and passive alignment techniques employing light intensity sensors and suction nozzles to ensure precise positioning, and bonding with a solder material that is melted during reflow to secure the light emitting component to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If friction material is introduced to suppress relative movement, then positioning precision is improved, but device complexity increases
Solution Approach 1:
A friction material is introduced as an intermediary element between the light emitting member and the substrate. This friction material suppresses relative movement during the bonding process, thereby improving positioning precision without requiring complex active control systems
Solution Approach 2:
The friction material is designed as a consumable component that is used temporarily during the bonding process. After serving its purpose of preventing relative movement, it is discarded, avoiding the need for complex reusable positioning mechanisms
2Manufacturing precision
If active alignment using light emission is employed, then alignment precision is improved, but energy consumption increases
Solution Approach 1:
The light emitting component operates at partial capacity solely for the duration of alignment. By using minimal light emission just sufficient for detection and positioning, the system achieves high alignment precision while minimizing energy consumption compared to continuous operation
Solution Approach 2:
The light emitting component serves dual purposes: it generates light for alignment detection and also provides the operational light function. This self-service capability eliminates the need for separate alignment and operational light sources, reducing overall energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high precision alignment and secure bonding of the light emitting member to the substrate, maintaining the optical axis alignment and electrical continuity, even during thermal expansion, thereby ensuring reliable optical interconnects for high-speed data transmission.
Implementation Method 1
causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that includes a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force
Implementation Method 2
bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member
Data Source
AI summary
A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force exerted on the substrate and the light emitting member, and positionally aligning the light emitting member to the substrate by employing light emitted from the light emitting component; and bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member.