Friction Stir Weld Enclosure for Thin-Thick Metal Sealing

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Solution Overview

Problem

Friction stir welding techniques are not effective for welding metal components with significantly different thicknesses, such as thin and thick components, which limits their application in creating hermetically sealed electronic device enclosures that require a reliable and high-quality seal to maintain a low-density atmosphere.

Innovation Solution

The development of specific base and cover components with features such as dimensions, shapes, and materials that facilitate efficient friction stir welding, including an interference fit between the cover lip and base shoulder, and the use of a rotating friction stir weld tool to form a hermetic seal around the perimeter of the enclosure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If friction stir welding is used to join metal components, then a hermetic seal can be achieved, but the technique is not effective when components have significantly different thicknesses

Engineering Contradiction:
Improvehermetic seal qualityVSAvoidapplicability to components with different thicknesses
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by creating a localized thickened region (protrusion) at the welding interface of the thinner component. This protrusion provides additional material volume specifically at the weld zone, enabling the friction stir welding process to effectively join components with significantly different thicknesses while maintaining hermetic seal quality.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs preliminary action by pre-forming the protrusion on the thinner metal component before the welding process. This preparatory step ensures that when friction stir welding is performed, there is sufficient material at the joint interface to create a reliable hermetic seal, even when joining components with large thickness differences.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If the base and cover are designed with specific features to facilitate friction stir welding, then welding efficiency and seal quality improve, but the manufacturing complexity of the base and cover increases

Engineering Contradiction:
Improvewelding efficiencyVSAvoidbase and cover structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the base component into distinct structural regions: a main body portion and a separately formed protrusion feature. This segmentation allows the protrusion to be created using specific forming processes while keeping the overall base design modular and manageable, balancing manufacturing complexity with welding efficiency.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of a high-quality friction stir weld that effectively seals the enclosure, maintaining a low-density atmosphere with minimal leakage, enhancing the reliability and performance of electronic devices like hard disk drives.

Implementation Method 1

Friction stir welding is a technique that is known to be useful in various applications for welding metals

Methodology Applied
Scientific EffectFriction: Friction

Implementation Method 2

contacting the joint with a rotating friction stir weld tool

Methodology Applied
Scientific EffectFriction stir welding: Friction Welding

Data Source

PatentUS10870167B2Enclosures, devices with a friction stir weld, precursors thereof, and related methods
Publication Date: 2020.12.22 SEAGATE TECH LLC
  • US10870167B2 patent drawing
  • US10870167B2 patent drawing
  • US10870167B2 patent drawing

AI summary

Described are enclosures that include a friction stir weld, including electronic device enclosures, and precursors thereof, that contain a base and a cover that in an assembled condition form a joint at which a friction stir weld can be produced, as well as methods for producing a friction stir weld at a joint of such an assembly.