Frit Bonding for Atomic Sensor Component Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing atomic sensors face challenges in maintaining the precise location and stability of external components due to vibrations and shocks, which affect their operative quality, and require multiple fabrication steps for secure mounting using adhesives or mechanical structures.
Innovation Solution
The use of frit to securely bond external components to the sensor body, allowing them to be rigidly attached and move together, reducing errors caused by vibrations and simplifying the fabrication process by joining multiple components simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external components are secured using adhesive or external mechanical structure, then components can be mounted on sensor body, but vibrations and shocks cause components and sensor to move in relation to one another affecting operative quality
Solution Approach 1:
The patent integrates the external component mounting structure directly into the sensor body by forming a recess within the sensor body that receives the external component. This merging eliminates the need for separate adhesive or mechanical mounting structures, creating a unified structure where the component and sensor body move together as one, thereby preventing relative movement during vibrations and shocks and maintaining operative quality.
2Ease of manufacture
If external components are secured using adhesive or external mechanical structure, then components can be mounted on sensor body, but multiple steps are required during fabrication
Solution Approach 1:
The patent combines the component mounting structure with the sensor body into a single integrated structure. The recess is formed directly within the sensor body, eliminating the need for separate mounting structures and multiple assembly steps. This integration simplifies the fabrication process by reducing the number of discrete components and assembly operations required.
Solution Approach 2:
The sensor body serves multiple functions: it provides the sensing capability and simultaneously provides the mounting structure for external components through the integrated recess. This multi-functionality eliminates the need for separate mounting structures and simplifies the overall device architecture, reducing fabrication complexity.
3Strength
If external components are secured using adhesive or external mechanical structure, then components can be mounted on sensor body, but components and sensor move in relation to one another under vibration and shock
Solution Approach 1:
The patent creates a unified structure by integrating the mounting recess directly into the sensor body. This merging ensures that the external component and sensor body move together as a single unit during vibrations and shocks, eliminating relative movement while maintaining strong structural attachment without requiring additional adhesives or mechanical fasteners.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the stability and accuracy of atomic sensors by ensuring components remain fixed relative to the sensor body, reducing errors from vibrations and shocks, and streamlining the manufacturing process by integrating multiple attachments in fewer steps.
Implementation Method 1
heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.