Frit-Mounted Atomic Sensor Components for Vibration Stability

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Solution Overview

Problem

Atomic sensors face accuracy issues due to vibrations and shocks caused by external components being secured using adhesives or mechanical structures, which require multiple fabrication steps and affect the sensor's operative quality.

Innovation Solution

The use of frit to securely mount external components on an atomic sensor, where frit is applied around the components and heated to weld them to the sensor body, providing a rigid attachment that moves with the sensor and reducing fabrication steps by allowing simultaneous bonding of multiple components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external components are secured using adhesives or mechanical structures, then components can be mounted on the sensor body, but vibrations and shocks cause movement between components and sensor body affecting accuracy

Engineering Contradiction:
ImproveaccuracyVSAvoidrelative position stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent merges the external components with the sensor body by bonding them together to form a single integrated structure. The housing is formed as one piece with the sensor body, eliminating separate mounting structures and adhesive layers that could fail under vibration and shock, thereby maintaining accurate relative positioning.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces traditional mechanical mounting structures (screws, clips, separate housings) with a monolithic integrated structure. This substitution eliminates mechanical interfaces that are susceptible to vibration and shock, providing superior stability for accurate sensing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If external components are secured using adhesives or mechanical structures, then components can be mounted on the sensor body, but multiple fabrication steps are required

Engineering Contradiction:
Improvefabrication processVSAvoidnumber of fabrication steps
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines multiple components and mounting operations into a single integrated housing structure that can be fabricated as one piece. This merging eliminates the need for separate adhesive application steps, mechanical assembly steps, and multiple alignment operations, significantly simplifying the fabrication process.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated housing structure serves multiple functions simultaneously: it protects the sensor, provides mounting for external components, and maintains precise geometric relationships. This multi-functionality is achieved through a single fabrication process rather than multiple specialized steps.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the rigidity of external components, reduces movement-related errors, and simplifies the fabrication process by securely bonding components to the sensor body, thereby improving the accuracy and stability of atomic sensors.

Implementation Method 1

heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentUS8854146B2Systems and methods for external frit mounted components
Publication Date: 2014.10.07 HONEYWELL INTERNATIONAL INC
  • US8854146B2 patent drawing
  • US8854146B2 patent drawing
  • US8854146B2 patent drawing

AI summary

Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.