Frit Seal Encapsulation for OLED Moisture Protection

The patent combines multiple encapsulation functions into a single integrated frit seal structure that simultaneously provides hermetic sealing, mechanical support, and electrical isolation. The frit seal is formed to contact both the substrate and the conductive line, merging the sealing function with the structural support function that would otherwise require separate components.

The frit seal utilizes composite material properties, combining glass powder with oxide additives to create a material that exhibits both hermetic sealing characteristics and appropriate thermal expansion properties. This composite formulation enables the single frit seal layer to achieve multiple protective functions simultaneously.

The patent introduces an insulating layer positioned between the frit seal and the second conductive line before the sealing process. This insulating layer acts as a protective cushion that prevents direct thermal contact during the heating process, while still allowing the frit seal to maintain effective sealing contact with the substrate and conductive line structure.

The insulating layer serves as an intermediary element that mediates between the heat-generating frit seal and the heat-sensitive conductive line. It allows thermal energy to be distributed more evenly while preventing localized overheating that could damage the conductive line, thus enabling effective sealing without thermal damage.