Frit Seal Design for OLED Light Leakage and Moisture
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Solution Overview
Problem
Existing organic light-emitting display devices face challenges in effectively blocking oxygen and moisture infiltration and light leakage, which can deteriorate the image quality and reduce the lifespan of the devices, especially when using frit encapsulation methods that are not comprehensive enough to cover all areas, including the non-pixel regions adjacent to the pixel regions.
Innovation Solution
A top emission type organic light-emitting display device is designed with a frit seal comprising glass material and absorbent for laser or infrared rays, applied between substrates to adhere them securely, with thicker frit at the edges and overlapping parts like scan drivers to prevent light leakage and moisture ingress, while using a method that involves applying frit paste, burning it, and then bonding the substrates using laser or infrared irradiation to create a secure and light-blocking seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If frit encapsulation is applied to edge regions only, then manufacturing complexity is reduced, but oxygen and moisture infiltration occurs through uncovered areas
Solution Approach 1:
The frit encapsulation is divided into multiple segments: a first frit segment applied to the edge region of the substrate, and a second frit segment applied to the non-pixel region. This segmentation allows each segment to serve its specific function while collectively providing comprehensive protection against oxygen and moisture infiltration.
Solution Approach 2:
Different regions of the substrate receive different encapsulation treatments: the edge region receives the first frit segment for basic sealing, while the non-pixel region receives the second frit segment for additional protection and light leakage prevention. This local differentiation optimizes both manufacturing efficiency and protection reliability.
2Object-affected harmful factors
If frit is applied to cover scan driver regions, then light leakage is prevented, but manufacturing complexity increases
Solution Approach 1:
The second frit segment is selectively applied only to the non-pixel region where the scan driver is located, providing localized light leakage prevention exactly where needed. This approach avoids unnecessary encapsulation in pixel regions, maintaining manufacturing simplicity while effectively addressing light leakage issues.
Solution Approach 2:
The scan driver region is identified in advance as a area prone to light leakage, so the second frit segment is pre-applied to this specific region before final device assembly. This preliminary targeted action prevents light leakage without requiring complex post-assembly modifications.
3Reliability
If thicker frit is used at edges and overlapping parts, then sealing effectiveness is improved, but material consumption increases
Solution Approach 1:
The frit encapsulation thickness is locally optimized: the first frit segment at the edge region and the second frit segment at the non-pixel region are applied with greater thickness to ensure hermetic sealing and light leakage prevention. This localized thickness enhancement concentrates material usage where it is most critical, improving seal effectiveness without uniformly increasing material consumption across the entire substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents oxygen and moisture infiltration, enhances image quality by blocking light leakage, and extends the lifespan of the organic light-emitting display devices by creating a robust and hermetic seal around the pixel and non-pixel regions, improving the overall performance and reliability of the display.
Implementation Method 1
effectively preventing the infiltration of oxygen and moisture by encapsulating a first substrate and a second substrate with a frit
Implementation Method 2
effectively preventing light leakage
Implementation Method 3
bonding the substrates using laser or infrared irradiation
Implementation Method 4
bonding the substrates using laser or infrared irradiation
Data Source
AI summary
Disclosed is an organic light-emitting display device capable of blocking the infiltration of oxygen and moisture, etc. by encapsulating an array of pixels by interconnecting first and second substrates with a frit. The organic light-emitting display device includes a first substrate, a second substrate opposing the first substrate, an array of pixels interposed between the first and second substrates, and a frit positioned between the first and the second substrate to adhere the first substrate to the second substrate. The frit is formed to overlap with at least a part of scan drivers.