Frit Sealing System for OLED Displays
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Solution Overview
Problem
The existing frit encapsulation methods for organic light emitting display devices face issues with short-term detachment and long-term reliability due to micro-cracks formed during the laser sealing process, which compromise the adhesion and moisture resistance of the frit sealant.
Innovation Solution
A frit sealing system that includes a bed member, a laser irradiation member, and a pressure member to compress the substrates during laser irradiation, enhancing the adhesion of the frit between the substrates and improving resistance to moisture and air infiltration, using a lattice structure or partial pressure member to concentrate compressive force for improved sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If only laser irradiation is used to harden the frit, then the sealing operation can be performed, but micro-cracks are formed on the brittle frit causing detachment and reliability problems
Solution Approach 1:
The patent combines laser irradiation with mechanical pressing operations into a single integrated sealing process. The pressing device applies compressive force to the substrates simultaneously with or immediately after laser irradiation, merging two separate operations into one coordinated process that prevents micro-crack formation while maintaining sealing effectiveness
Solution Approach 2:
The pressing device provides mechanical support and compressive force before and during the laser irradiation process, cushioning the brittle frit against thermal stress and preventing micro-crack formation. This prior mechanical support compensates for the inherent brittleness of the frit material during the heating process
2Ease of manufacture
If laser irradiation is applied to melt the frit without mechanical pressing, then the sealing process is simple, but the temperature drops sharply causing micro-crack formation
Solution Approach 1:
The patent merges laser irradiation and mechanical pressing into a single coordinated operation, maintaining process simplicity while improving sealing quality. The integrated system applies both thermal and mechanical energy simultaneously, eliminating the need for complex multi-step processes while achieving superior sealing results
Solution Approach 2:
The sealing process uses a composite approach combining thermal energy (laser) and mechanical energy (pressing) to achieve the desired sealing effect. This composite method leverages the advantages of both approaches: the precision of laser heating and the crack-prevention capability of mechanical pressing
3Object-affected harmful factors
If frit encapsulation is used to seal the organic light emitting display device, then moisture and oxygen protection is improved, but micro-cracks reduce long-term reliability
Solution Approach 1:
The pressing device provides mechanical support before and during laser irradiation, preventing micro-crack formation that would compromise long-term reliability. This prior cushioning ensures the frit seal remains intact and effective against moisture and oxygen penetration over extended periods
Solution Approach 2:
The frit material serves as a sacrificial sealing layer that, when properly formed without micro-cracks, provides effective moisture and oxygen barrier. The pressing operation ensures the frit forms a continuous, crack-free seal that maintains its protective function throughout the device's operational life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively increases the adhesion and long-term reliability of the frit sealant, reducing the risk of detachment and enhancing the sealing efficiency, thereby protecting the organic light emitting display devices from environmental damage.
Implementation Method 1
a laser irradiation member irradiating a laser to the frit between the first substrate and the second substrate
Implementation Method 2
melting the frit and sealing the first substrate and the second substrate
Implementation Method 3
a pressure member configured to compress the first substrate and the second substrate, thereby compressing the frit between the first substrate and second substrate during irradiation
Data Source
AI summary
A frit sealing system and a method of manufacturing an organic light emitting display device by using the frit sealing system, and more particularly, a frit sealing system and a method of manufacturing an organic light emitting display device by using the frit sealing system, which includes a pressure member so as to physically pressurize a first substrate and a second substrate, thereby increasing adhesion of a frit when the first substrate and the second substrate are adhered to each other by using the frit. The frit sealing system, adhering the first substrate and the second substrate by using the frit, includes: a bed member on which the first substrate is placed; a laser irradiation member irradiating a laser to the frit between the first substrate and the second substrate; and a pressure member disposed on an upper part of the first substrate and the second substrate irradiated with the laser and adhered, thereby pressurizing the first substrate and the second substrate irradiated with the laser and adhered.