Front-End Matching Circuit With Integrated Shunt Inductor
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Solution Overview
Problem
Existing electrical components in front-end circuits of transmitting-receiving devices experience high losses due to inefficient matching of input impedances and lack of space-saving designs.
Innovation Solution
An electrical component with a shunt arm inductor and series capacitor integrated into a carrier substrate, along with capacitive coupling between matching circuits, forms a high-input-impedance signal path with reduced size, utilizing a carrier substrate with LTCC ceramic dielectric layers and superposed conducting surfaces for efficient frequency matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional matching circuits are used with separate inductors and capacitors, then the circuit can achieve impedance matching, but the component size becomes large and signal losses increase
Solution Approach 1:
The patent combines multiple discrete matching circuit components (inductors and capacitors) into a single integrated matching circuit structure. The inductor is formed by a conductor winding and the capacitor by conducting surfaces, both integrated on the same carrier substrate, reducing the overall component footprint and minimizing inter-component parasitic effects that cause signal losses.
Solution Approach 2:
The patent introduces a carrier substrate as an intermediary platform that integrates the matching circuit components. This substrate provides a controlled impedance environment and minimizes parasitic inductances and capacitances between components, thereby reducing signal losses while maintaining compact dimensions.
2Reliability
If separate matching circuits are used for each signal path, then impedance matching can be achieved, but the device complexity and space requirements increase
Solution Approach 1:
The patent designs a universal matching circuit architecture where the integrated inductor and capacitor structures can serve multiple signal paths. The matching circuit is configured to handle both transmitting and receiving signal paths simultaneously, reducing overall device complexity while maintaining reliable impedance matching across all paths through the common integrated structure.
3Ease of manufacture
If traditional discrete components are used for matching circuits, then the circuit can be assembled, but manufacturing precision requirements increase and production becomes more difficult
Solution Approach 1:
The patent merges multiple discrete components into integrated structures fabricated as single units on the carrier substrate. The inductor is formed by a continuous conductor winding and the capacitor by patterned conducting surfaces, both created through standard PCB or ceramic substrate fabrication processes, eliminating the need for precise placement of multiple discrete components and significantly easing manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves low signal losses and a space-saving design by effectively matching input impedances and increasing effective inductance values, allowing for efficient operation across various frequency bands with reduced component size.
Implementation Method 1
an inductor is arranged, which is connected to the first signal path, to the second signal path, and to the common signal path
Implementation Method 2
The second matching circuit presents a second capacitor, which is arranged in a series arm of the second signal path
Implementation Method 3
carrier substrate with LTCC ceramic dielectric layers and superposed conducting surfaces
Implementation Method 4
The first matching circuit and optionally a second matching circuit match the input impedances of the first filter and of the second filter in such a way that the signal path presents a high input impedance in the adjacent channel
Data Source
AI summary
An electrical component includes a first signal path and a second signal path electrically connected to a common signal path. The electrical component also includes a first filter in the first signal path and a second filter in the second signal path. The electrical component also includes a first matching circuit comprising a shunt arm to ground. The first matching circuit is electrically connected to the first signal path, the second signal path, and the common signal path.