Front-end module with stacked core cavity inductor
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Solution Overview
Problem
As portable terminals become miniaturized and multi-functional, there is a challenge in reducing the size of front-end modules due to limitations in the number and functionality of components that can be mounted on a substrate, especially as operating frequencies increase, leading to constraints in implementing components as a single module within the substrate.
Innovation Solution
A front-end module design featuring a substrate with alternately stacked insulating and wiring layers, a core member with a thicker insulating layer forming a cavity for reactance components, and a ground plane electrically connected to radio-frequency components, which allows for the amplification or filtering of RF signals while minimizing size through optimized component placement and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of components and functions mounted on the substrate is increased to handle higher operating frequencies, then the signal processing capability is improved, but the size of the front-end module increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of components on the substrate to a three-dimensional stacked configuration. Multiple connection members with alternating insulating and wiring layers are stacked vertically, allowing signals to traverse through multiple layers. This vertical stacking enables more components and functions to be integrated within the same footprint, improving signal processing capability without proportionally increasing the module's planar area.
Solution Approach 2:
The patent implements a nested structure where connection members are stacked within the substrate, and components are mounted on different layers. The core member with cavity is nested within the substrate structure, and reactance components are placed within the cavity. This nesting approach allows multiple functional elements to occupy overlapping spatial regions, increasing component density and enabling more functions without increasing the overall module size.
2Area of stationary object
If components are integrated into a single module within the substrate, then the module size is reduced, but the number of mountable components and functions is limited
Solution Approach 1:
By stacking connection members vertically with multiple insulating and wiring layers, the patent creates additional spatial dimensions for component placement. This vertical expansion allows more components to be mounted on different layers while maintaining a compact planar footprint, thus integrating more functions into a single module without increasing the module's overall size.
Solution Approach 2:
The substrate is segmented into multiple functional layers with distinct connection members, each handling specific signal paths or functions. This segmentation allows independent optimization of each layer for specific functions while maintaining overall integration, enabling a greater number of functions to be packed into the module without increasing its size.
3Reliability
If the distance between the inductor and ground plane is increased, then the Q factor is improved and insertion loss is reduced, but the vertical space required increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking connection members with multiple insulating layers between the inductor and ground plane. This vertical stacking approach provides the necessary separation distance to improve Q factor and reduce insertion loss while maintaining a compact overall module size, as the increased distance is achieved in the vertical direction rather than requiring larger planar dimensions.
Data Source
AI summary
A front-end module includes: a substrate including a first connection member in which at least one first insulating layer and at least one first wiring layer are alternately stacked, a second connection member in which at least one second insulating layer and at least one second wiring layer are alternately stacked, and a core member disposed between the first and second connection members; a radio-frequency component mounted on a surface of the substrate and configured to amplify a main band of an input RF signal or filter bands outside the main band; an inductor disposed on a surface of the core member and electrically connected to the radio-frequency component; and a ground plane disposed on another surface of the core member. The core member includes a core insulating layer thicker than an insulating layer among at least one first insulating layer and the at least one second insulating layer.