Front-Facing Heat Dissipation Opening for Notebook Thermal Management
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Solution Overview
Problem
The challenge is to enhance heat dissipation efficiency in notebook computers without increasing their thickness and weight, as larger heat dissipation openings are typically required but come at the cost of increased thickness and weight.
Innovation Solution
The electronic device incorporates a first opening as part of a heat airflow path that faces towards the display module, allowing for improved heat dissipation without affecting the device's thickness, and optionally includes additional airflow paths and heat-dissipating structures, such as heat pipes and heat sinks, to optimize cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the area of heat dissipation openings is increased to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but thickness and weight of the notebook computer increase
Solution Approach 1:
The patent introduces a new spatial dimension by making the heat dissipation opening face toward the display module (front-facing orientation) rather than only rear or side openings. This three-dimensional airflow path allows heat to be dissipated through the thickness direction and lateral directions simultaneously, improving heat dissipation efficiency without increasing the footprint area, thereby avoiding increased weight.
2Temperature
If the area of heat dissipation openings is increased to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but thickness of the notebook computer increases
Solution Approach 1:
The patent utilizes the thickness direction as an additional heat dissipation dimension by orienting the heat dissipation opening to face the display module. This allows hot air to escape through the front-facing opening without requiring increased thickness of the device body, as the airflow path efficiently utilizes the existing internal volume and thickness space.
Solution Approach 2:
The heat dissipation system is segmented into multiple airflow paths: a first airflow path through the front-facing opening and a second airflow path through rear/side openings. This segmentation allows heat to be dissipated through multiple directions simultaneously, improving overall heat dissipation efficiency without requiring any single opening to be excessively large, thereby avoiding increased thickness.
3Temperature
If additional airflow paths and heat-dissipating structures are added to optimize cooling efficiency, then cooling efficiency is optimized, but device complexity increases
Solution Approach 1:
The patent combines multiple heat dissipation functions into a unified system where the display module serves dual purposes: as the display interface and as a heat dissipation surface. The heat dissipation opening faces the display module, allowing the display assembly to act as both a functional component and a thermal management component, thereby optimizing cooling efficiency without proportionally increasing device complexity.
Solution Approach 2:
The display module is given multiple functions: it serves as the display interface for users and simultaneously as a heat dissipation surface. The airflow path is designed to pass through or near the display module, enabling it to perform both display and thermal management functions. This multi-functionality optimizes cooling efficiency without adding separate dedicated components, thereby controlling device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency while maintaining the device's thickness and weight, and can include automatic switching mechanisms to optimize airflow and appearance, ensuring effective cooling for high-power configurations.
Implementation Method 1
a first opening (21) as a part of a first airflow path for dissipating heat generated by the first processor
Implementation Method 2
optionally includes additional airflow paths and heat-dissipating structures, such as heat pipes and heat sinks, to optimize cooling efficiency
Data Source
AI summary
The present disclosure provides an electronic device. The electronic device includes a first body including a display module for displaying content; and a second body coupled with the first body and including a first processor for generating the displayed content. The second body includes a first opening as a part of a first airflow path for dissipating heat generated by the first processor; and the first opening faces toward the first body.