Front Frame Support Area for Sealing Member Stability

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Solution Overview

Problem

Existing electronic devices face challenges in effectively supporting and protecting sealing members within the sound module, which can lead to damage during the assembly process of the printed circuit board (PCB) on the housing.

Innovation Solution

The electronic device incorporates a housing with a front frame that includes a support area to securely hold the sealing member along its circumferential direction. This support area is designed with inclined first and second support surfaces to distribute the load evenly and prevent slipping, ensuring the sealing member is properly seated between the front frame and the PCB.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sealing member is installed in the sound module without a dedicated support structure, then the device complexity is reduced, but the sealing member is vulnerable to damage during PCB assembly processes

Engineering Contradiction:
Improvesealing member protectionVSAvoidhousing structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The support area for the sealing member is integrated within the housing structure, nesting the protective function inside the existing housing rather than adding a separate external component. This resolves the contradiction by providing protection without significantly increasing overall device complexity

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The support area is pre-formed in the housing during housing manufacturing, before the sealing member is installed. This preliminary preparation ensures the sealing member is protected from the start of the assembly process without requiring additional protective measures during assembly

Inventive Principle:
Principle #10Preliminary action

2Reliability

If the sealing member is held firmly to prevent movement, then reliability improves, but the sound transfer capability between the acoustic duct and opening may be compromised

Engineering Contradiction:
Improvesealing member stabilityVSAvoidsound transfer obstruction
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The support area provides localized holding of the sealing member at specific positions, while leaving other areas of the sealing member free to perform sound transfer functions. This resolves the contradiction by applying constraint only where necessary for stability, not where it would obstruct sound transfer

Inventive Principle:
Principle #3Local quality

3Object-generated harmful factors

If the sealing member is positioned precisely for optimal sound transfer, then sound transfer efficiency improves, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvesound transfer efficiencyVSAvoidsealing member positioning
Core Design Contradiction:
Object-generated harmful factorsVSManufacturing precision

Solution Approach 1:

The support area is pre-formed in the housing with built-in positioning features that guide the sealing member into the correct position during assembly. This reduces manufacturing precision requirements by providing mechanical guidance rather than relying solely on high-precision assembly operations

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The support area acts as an intermediary structure between the housing and the sealing member, facilitating proper positioning and alignment. This mediator enables accurate positioning without requiring extremely precise direct mating between the sealing member and other components

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250031326A1Electronic device including support area for support sealing member
Publication Date: 2025.01.23 SAMSUNG ELECTRONICS CO LTD
  • US20250031326A1 patent drawing
  • US20250031326A1 patent drawing
  • US20250031326A1 patent drawing

AI summary

An electronic device may include a housing forming a side surface surrounding an internal space, and including a front frame which is disposed in the internal space and forms at least a portion of the side surface, and on which a sound hole for transferring a sound from an outside of the electronic device to the internal space, and an acoustic duct communicating with the sound hole are formed, a printed circuit board (PCB) which is supported by the front frame and includes a first board surface, a second board surface, and an opening, a sound module disposed on, directly or indirectly, the first board surface to overlap the opening, and a sealing member that seals a portion between the front frame and the PCB. The front frame includes a support area supporting the sealing member along a circumferential direction of the sealing member.