Front-Mounted Heat Sink for LED Illumination
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Solution Overview
Problem
Conventional LED illumination systems face inefficiencies due to heat dissipation challenges, as rear heatsinks do not benefit from natural air flow, leading to reduced extraction efficiency and increased cost, and heat is often directed into walls or ceilings rather than the environment, affecting light output and longevity.
Innovation Solution
An illumination apparatus with a heat dissipating structure integrated on the same side as the light emitting elements, allowing heat to be dissipated in the same direction as light output, utilizing a thermally conductive substrate and fins to enhance air flow and optical control, thereby improving heat extraction and light directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat dissipating structure is positioned on the rear of LED (conventional approach), then heat extraction is achieved, but natural air flow benefit is lost and extraction efficiency is reduced
Solution Approach 1:
The patent inverts the conventional heat dissipation approach by positioning the heat dissipating structure on the front surface of the substrate (same side as light emission) rather than on the rear. This allows the heat dissipating structure to benefit from natural air flow in the illuminated environment while maintaining effective heat extraction from the LED chips through the substrate.
2Loss of energy
If heat dissipating structure is positioned on the rear of LED, then heat extraction is achieved, but heat is directed into walls/ceilings rather than environment
Solution Approach 1:
The patent inverts the heat dissipation direction by positioning the heat dissipating structure on the front surface, causing heat to be dissipated into the illuminated environment rather than into walls or ceilings. This provides heating benefit to the environment while maintaining effective heat extraction.
3Loss of energy
If conventional rear heatsink is used, then heat extraction is achieved, but device complexity and cost increase
Solution Approach 1:
The patent merges the heat dissipating structure with the substrate, integrating both into a single component. The substrate serves dual functions as both the mounting platform for LED chips and the heat dissipation pathway, eliminating the need for separate heatsink components and reducing assembly complexity.
Solution Approach 2:
The substrate is designed to perform multiple functions: electrical insulation between LED chips, mechanical support for mounting LED chips, and thermal conduction for heat dissipation. This multi-functionality reduces the number of components needed and simplifies the overall device structure.
4Loss of energy
If conventional rear heatsink is used, then heat extraction is achieved, but light output efficiency is reduced
Solution Approach 1:
The patent inverts the heat dissipation direction to the front surface, positioning the heat dissipating structure on the same side as light emission. This allows heat to be extracted from LED chips through the substrate without interfering with light output, thereby maintaining higher light output efficiency while achieving effective heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light output efficiency, extends LED lifetime, reduces system complexity and cost, and allows for more uniform heat dissipation into the environment, improving optical quality and reducing heating loads.
Implementation Method 1
the heat dissipating structure thermally coupled to the light emitting elements at least to an extent via the substrate such that in operation heat from the light emitting elements is dissipated by the heat dissipating structure
Implementation Method 2
Heat is not typically extracted in the same direction as the light output direction. For recessed devices, the heat dissipating structure does not benefit from natural air flow present in the illuminated environment
Implementation Method 3
Heat generated by inefficiencies in these lamps is typically radiated into the illuminated environment
Data Source
AI summary
An illumination apparatus, a method of manufacture of the same and a heat sink apparatus for use in said illumination apparatus in which an array of optical elements directs light from an array of light emitting elements through a heat dissipating structure to achieve a thin and efficient light source that provides directional illumination with efficient dissipation of generated heat into the illuminated environment.


