Front-Side Interposer Circuit Module for Flipped Thermal Paths
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Solution Overview
Problem
Existing power amplifier modules face challenges in configurations where the thermal path for heat produced by power transistor dies extends away from the system PCB, complicating the provision of input/output signals, bias voltages, and ground references.
Innovation Solution
The power amplifier module is mounted in a 'flipped orientation' with the embedded heat dissipation structure facing away from the system substrate, allowing direct connection to a heat sink, and incorporates terminal and shield/ground interposers for optimized signal and ground references.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermal path extends away from the system PCB, then heat dissipation is improved, but providing ground reference and signal connections becomes more complex
Solution Approach 1:
The patent introduces a ground interposer as an intermediary component between the power transistor die and the system PCB. This ground interposer provides a dedicated ground reference path that is electrically connected to the die but thermally isolated from the heat dissipation path extending away from the PCB, thereby resolving the complexity of providing ground references when the thermal path is non-conventional
Solution Approach 2:
The patent segments the functional paths by separating the ground reference function from the heat dissipation function. The ground interposer handles only ground reference connections, while the heat dissipation structure extends independently away from the PCB. This segmentation allows each function to be optimized independently without interfering with the other
2Reliability
If terminal interposers are added for signal connections, then signal and ground reference provision is improved, but device complexity increases
Solution Approach 1:
The ground interposer is designed to serve multiple functions: providing ground reference connections to the power transistor die, establishing electrical connections to the system PCB, and maintaining thermal isolation from the heat dissipation path. This multi-functionality reduces the need for separate dedicated components for each function, thereby improving reliability without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat and provides reliable ground and signal connections, enhancing the performance of power amplifier modules in non-conventional thermal path scenarios.
Implementation Method 1
one or more embedded heat dissipation structures that extend through the module substrate, with first surfaces of the heat dissipation structures exposed at the mounting surface of the module substrate... heat generated by the power transistor die is dissipated through the ground/thermal dissipation structure(s)
Implementation Method 2
a heat sink coupled to the exposed first surfaces of the heat dissipation structures
Implementation Method 3
a heat sink coupled to the exposed first surfaces of the heat dissipation structures
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A circuit module (e.g., an amplifier module) includes a module substrate, a thermal dissipation structure, a semiconductor die, encapsulant material, and an interposer. The module substrate has a mounting surface and a plurality of conductive pads at the mounting surface. The thermal dissipation structure extends through the module substrate, and a surface of the thermal dissipation structure is exposed at the mounting surface of the module substrate. The semiconductor die is coupled to the surface of the thermal dissipation structure. The encapsulant material covers the mounting surface of the module substrate and the semiconductor die, and a surface of the encapsulant material defines a contact surface of the circuit module. The interposer is embedded within the encapsulant material. The interposer includes a conductive terminal with a proximal end coupled to a conductive pad of the module substrate, and a distal end exposed at the contact surface of the circuit module.