Multi-functional front slice panel for aerospace chassis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic equipment enclosures in aerospace and airborne vehicles face challenges due to increased complexity in design and testing caused by external connectors, limited support for various connector sizes, and the need for separate EMI/RFI shielding, which complicates maintenance and makes them more susceptible to environmental stresses like vibrations and shocks.
Innovation Solution
A modular electronic chassis with multi-functional slice front panels that allow for interchangeable circuit card assemblies with various external connector configurations, eliminating the need for a separate EMI/RFI shield and enabling individual replacement of circuit cards while maintaining operational integrity, thus reducing complexity and enhancing adaptability and maintainability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If external interconnections are positioned on a backplane PWB or PCB assembly, then structural strength and durability are provided, but design complexity and test equipment complexity increase
Solution Approach 1:
The front panel is divided into multiple slice panels that can be independently removed and replaced. Each slice panel corresponds to a specific circuit card assembly, allowing modular replacement without affecting other components. This segmentation reduces design complexity by breaking down the integrated front panel into manageable units while maintaining structural integrity through the chassis framework.
2Object-affected harmful factors
If a separate EMI/RFI shield is attached to the front of the chassis, then EMI/RFI shielding is provided, but external interconnects cannot be positioned on the front panel
Solution Approach 1:
The EMI/RFI shield is merged with the slice panel structure. Each slice panel includes integrated EMI/RFI shielding components, combining the previously separate functions of front panel access and electromagnetic shielding into a single unified component. This allows external interconnects to be positioned on the front panel while maintaining EMI/RFI protection.
Solution Approach 2:
The slice panel serves multiple functions simultaneously: it provides the front panel interface for external interconnects, enables EMI/RFI shielding, and allows for modular replacement of circuit card assemblies. This multi-functionality eliminates the need for separate components and increases design flexibility.
3Adaptability or versatility
If the chassis receives multiple circuit card assemblies with different form-factors, then adaptability is improved, but structural integrity may be compromised
Solution Approach 1:
The slice panel design allows for dynamic configuration of the front panel to accommodate different circuit card assembly form-factors. The modular slice panels can be adjusted or replaced to match different connector configurations and sizes, enabling the chassis to adapt to various form-factors while maintaining structural integrity through the standardized chassis framework.
Data Source
AI summary
A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot.