Front Side Illuminated Semiconductor Reflecting Layer Light Absorption
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Solution Overview
Problem
Conventional front side illuminated semiconductor structures have low light absorption efficiency as they do not reuse light beams that are not initially absorbed by light sensing elements.
Innovation Solution
A reflecting layer is formed on the bottom surface of the base layer to reflect unabsorbed light back to the light sensing elements, improving light absorption efficiency by re-directing residual light for re-absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional front side illuminated semiconductor structure is used, then the structure is simple, but light absorption efficiency is low
Solution Approach 1:
The patent converts the harmful effect of unabsorbed light (which would be wasted) into a beneficial effect by using a reflecting layer to redirect this light back to the light sensing elements, enabling re-absorption and improving overall light absorption efficiency
Solution Approach 2:
The patent introduces a reflecting layer as an intermediary component between the base layer and the light sensing elements. This intermediary redirects unabsorbed light back to the sensing elements, solving the problem of light loss without fundamentally changing the main structure
2Loss of energy
If light reflecting layer is added to improve light absorption, then light absorption efficiency is improved, but manufacturing process becomes more complex
Solution Approach 1:
The patent performs preliminary processing of the bottom surface of the base layer (grinding or polishing) before coating the reflecting layer. This preliminary action ensures proper surface quality for optimal reflecting layer performance, while the overall process remains integrated into the existing manufacturing flow
3Loss of energy
If bottom surface of base layer is processed by grinding or polishing, then light absorption efficiency is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent integrates the bottom surface processing step into the existing packaging process workflow, allowing the same manufacturing infrastructure to serve multiple functions. The grinding or polishing step is performed as part of the overall device preparation, minimizing additional time investment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reflecting layer effectively increases light absorption efficiency by re-absorbing emergent light that was initially not absorbed by the light sensing elements, enhancing the overall performance of the semiconductor structure.
Implementation Method 1
a light reflecting layer is then formed on the processed bottom surface of the base layer. The light reflecting layer is configured to reflect the light beam not firstly being absorbed by light sensing elements back to the light sensing elements
Data Source
AI summary
There is provided a front side illuminated (FSI) semiconductor structure with improved light absorption efficiency which is configured to provide a reflecting layer on a bottom of the FSI semiconductor structure to enhance the light absorption efficiency, wherein the reflecting layer is manufactured in the packaging process or the semiconductor process.