Fuel Cell Stack Manifold Structure for Crack-Resistant Sealing

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Solution Overview

Problem

Existing fuel cell and electrolytic cell stack devices face issues with sealing material cracking due to thermal expansion and shrinkage, leading to gas leaks and reduced long-term reliability, as the manifold's high rigidity generates stress that cracks the sealing material during bonding.

Innovation Solution

The cell stack device incorporates a first manifold with a frame body and a plate body of varying rigidity, where the plate body with lower rigidity relieves stress from thermal shrinkage, and the frame body is bonded to the plate body using a thermal-resistant material, reducing the likelihood of sealing material cracking and gas leaks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the manifold is made with high rigidity to ensure structural strength, then the structural strength is improved, but the sealing material cracks due to thermal expansion and shrinkage stress

Engineering Contradiction:
Improvestructural strengthVSAvoidsealing reliability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The manifold is divided into two distinct parts: a frame body with high rigidity for structural support, and a plate body with lower rigidity that can flex during thermal expansion and shrinkage. This segmentation allows each part to perform its specific function without compromising the other, resolving the contradiction between structural strength and sealing reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different parts of the manifold are given different rigidity properties tailored to their specific functions. The frame body maintains high rigidity for structural integrity, while the plate body has lower rigidity to accommodate thermal deformation. This local differentiation of material properties allows the system to simultaneously achieve both structural strength and sealing reliability.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If the manifold rigidity is increased to maintain structural integrity, then structural integrity is improved, but stress from thermal shrinkage increases causing sealing material to crack

Engineering Contradiction:
Improvestructural integrityVSAvoidthermal stress
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

By segmenting the manifold into frame body and plate body with different rigidities, the thermal stress is isolated to the plate body portion which is designed to accommodate it. The frame body maintains structural integrity without being subjected to the full thermal stress, thus resolving the contradiction between structural integrity and thermal stress resistance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The rigidity parameter is changed locally in the plate body to be lower than the frame body. This parameter change allows the plate body to flex and absorb thermal stress, preventing it from transmitting to the frame body and causing cracks in the sealing material, while the frame body maintains its high rigidity for structural integrity.

Inventive Principle:
Principle #35Parameter changes

3Strength

If the sealing material is bonded to a rigid manifold, then bonding strength is improved, but the sealing material cracks during thermal cycling

Engineering Contradiction:
Improvebonding strengthVSAvoidservice life
Core Design Contradiction:
StrengthVSDuration of action of stationary object

Solution Approach 1:

The bonding interface is segmented between the frame body (high rigidity) and plate body (lower rigidity). The sealing material is bonded to both parts, but the plate body's lower rigidity allows it to flex during thermal cycling, reducing stress on the bonding interface and preventing cracks, while the frame body provides stable anchoring points for the bonding.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The plate body is designed with lower rigidity beforehand to act as a cushioning element during thermal cycling. This pre-designed flexibility absorbs the thermal expansion and shrinkage stresses, protecting the bonding interface and sealing material from crack formation, thereby extending the service life of the sealed structure.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses cracking of the sealing material and gas leaks, enhancing the long-term reliability and power generation efficiency by managing thermal stress and maintaining a stable gas flow within the fuel cell stack device.

Implementation Method 1

the plate body with lower rigidity relieves stress from thermal shrinkage

Methodology Applied
Scientific EffectThermal shrinkage: Thermal Contraction

Implementation Method 2

the frame body is bonded to the plate body using a thermal-resistant material

Methodology Applied
Scientific EffectThermal resistance: Thermal Insulation

Data Source

PatentEP3276729B1Cell stack device, module, and module housing device
Publication Date: 2024.02.07 KYOCERA CORP
  • EP3276729B1 patent drawingFigure 1~2B
  • EP3276729B1 patent drawingFigure 3~4
  • EP3276729B1 patent drawingFigure 5A~5B

AI summary

A cell stack device in the present disclosure includes: a cell stack including a plurality of arranged cells; and a first manifold configured to fix a first end of each of the cells with a sealing material and supply reactive gas to the cells 3. The first manifold includes a frame body configured to fix the first end of each of the cells with the sealing material inside the frame body, and a plate body bonded to a first end portion of the frame body and having a rigidity lower than that of the frame body. A module in the present disclosure includes a housing and the cell stack device housed in the housing. Furthermore, a module housing device in the present disclosure includes an external casing, the module in the external casing, and an auxiliary device configured to operate the module in the external casing.