Fuel Cell Substrate Conductive Path Formation
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Solution Overview
Problem
Conventional methods for forming conductive pathways in fuel cell substrates often result in residual material issues, such as uneven surfaces, clogging, and alteration of mechanical or electrical properties, and involve material removal which can lead to inefficiencies and substrate damage.
Innovation Solution
A method that forms conductive pathways through a substrate without removing substrate material, using a puncturing tool to create apertures and insert electrically conductive material, ensuring the substrate remains gas-tight and minimizing material waste, allowing for a variety of conductive materials and avoiding the challenges associated with material removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If material is removed from the substrate to form apertures, then conductive pathways can be created, but residual material remains causing uneven surfaces and clogging
Solution Approach 1:
The patent extracts only the minimal necessary substrate material to create apertures, using a puncturing tool that removes only enough material to form a channel while leaving the surrounding substrate intact. This selective extraction approach creates conductive pathways without generating excessive residual material that would cause surface unevenness or clogging.
Solution Approach 2:
The patent discards minimal substrate material during aperture formation and recovers the structural integrity of the substrate by maintaining gas-tight seals around the apertures. The puncturing process removes only the essential material needed for conductor insertion while preserving the overall substrate structure and function.
2Manufacturing precision
If material is removed using conventional methods, then apertures are formed, but substrate mechanical and electrical properties are altered
Solution Approach 1:
The patent replaces aggressive mechanical removal methods with a controlled puncturing process that creates apertures through localized material displacement rather than extensive removal. This substitution preserves the substrate's mechanical strength and electrical properties while achieving the necessary aperture formation for conductor insertion.
Solution Approach 2:
The patent applies local quality changes by creating apertures only in specific regions where conductive pathways are needed, leaving the rest of the substrate unchanged. The puncturing process modifies only the local area required for conductor insertion, preserving the overall stability and properties of the substrate.
3Manufacturing precision
If substrate material is removed to create pathways, then conductors can be inserted, but gas-tight sealing becomes difficult
Solution Approach 1:
The patent performs preliminary action by creating apertures through puncturing before inserting conductors, ensuring that the aperture walls remain intact and capable of forming gas-tight seals. The puncturing process prepares the substrate by creating controlled channels that maintain structural integrity, enabling subsequent sealing operations.
Solution Approach 2:
The patent utilizes the substrate's thin film structure to achieve gas-tight sealing around apertures. The puncturing process creates apertures that allow the surrounding thin substrate material to conform and seal around inserted conductors, maintaining gas-tight barriers while accommodating the conductive pathways.
Data Source
AI summary
The present invention relates to electrically conductive paths in planar substrates. Various embodiments provide a method of forming one or more electrically conductive paths in a planar substrate, wherein substantially none of the substrate is removed during formation of the path. In various embodiments, by avoiding the removal of substrate during formation of the electrically conductive path, problems caused by residual substrate material can be advantageously avoided. In various embodiments, the planar substrate with the electrically conductive path can be used to make a planar fuel cell array.